Market Report · May 18, 2026
This market report covers trends, opportunities, and forecasts in the global rigid 1-2 sided in the global pcb market to 2031 by material technology (glass fabric, epoxy resin, kraft paper, phenolic resin, and polyimide film), end use industry (computers/peripherals, communications, consumer electronics, industrial electronics, automotive, military/aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)
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• Growing Epoxy Resin Usage: Epoxy resins are gradually replacing phenolic resins due to their greater thermal resistance, mechanical strength, and suitability for high-frequency applications. These make them a must for automotive and industrial usage.
• Polyimide Films: Polyimide films are gaining popularity due to their flexibility and high-temperature resistance, along with excellent electrical insulation, fulfilling the rising demand for advanced electronics.
• Halogen-Free Materials: Ramping up on issues of the environment and regulatory requirements, halogen-free materials are increasingly adopted so that their performance is high while meeting the standards followed by RoHS and REACH.
• Advances in Glass Fabric Technology: Improving glass fabric technologies provides PCB stability for better reliability and signal integrity with a strong focus on requirements, especially at high data speeds.
• Towards Light and Ultra-Thin Designs: The drive towards compact electronics is propelling manufacturers to think of thinner, lighter designs with advanced material combinations without compromising on robustness. These trends highlight the dynamic evolution of rigid 1-2 sided in the global PCB technology, opening doors for greater innovation, sustainability, and application versatility in modern electronics.

• Potential of the Technology: The advanced material, such as epoxy resin and polyimide films, enhances thermal, mechanical, and electrical properties, allowing for applications in IoT, automotive, and 5G technologies.
• Degree of Disruption: It is changing manufacturing from traditional to advanced materials; it enables eco-friendly production and replaces legacy processes with high-performance solutions.
• Degree of Current Technological Maturity: The development of legacy technologies is mature, while halogen-free and polyimide-based developments are being rapidly advanced but still on the way to being mature.
• Regulatory Compliance: Strict regulations like RoHS and REACH are forcing the need for halogen-free and recyclable materials, thus encouraging sustainable and compliant manufacturing practices. The rigid 1-2 sided PCB technology is aiding the innovation of sustainability along with high performance, eco-friendliness, and compliance with regulation in the global electronics industry.
• Nippon Mektron: Nippon Mektron has oriented its strategy toward enhancing HDI technologies, greatly improving the performance of advanced electronics for use in the automotive and telecommunications markets. The technology of this development can be seamlessly integrated into next-generation devices to create compact and efficient PCB designs.
• TTM Technologies: TTM Technologies has developed high-performance thermal management solutions, using innovative epoxy resin materials to enhance heat dissipation. This supports applications like 5G infrastructure and data centers.
• Unimicron Technology: Unimicron has pioneered the adoption of halogen-free and low-loss materials, ensuring environmentally friendly standards while maintaining high-speed data transmission capabilities, in line with green electronics initiatives.
• Epec: Epec has expanded its competencies in rapid prototyping and production of custom PCBs using polyimide films with faster development cycles, which is critical for aerospace and medical applications.
• Compeq Manufacturing: Compeq focuses on implementing thinner, lighter designs for PCBs in its consumer electronics products, utilizing advanced material technologies to ensure that such reduced-size packages do not compromise reliability. These are examples of how leading players are furthering rigid 1-2 sided PCB technology through the application of advanced materials, increased environmental sensitivity, and high-performance application demands. These advancements interact to boost the market’s flexibility and growth potential.
• Evolving Demand for Miniaturized Devices: The increasing usage of smartphones, IoT devices, and wearables is driving demand for miniature and efficient PCB designs, leading to innovations in materials and processes.
• Automotive Electronics Increasing Popularity: The growing adoption of electronic systems in automobiles, including ADAS and EVs, has increased the demand for reliable and thermally stable PCBs.
• Advances in Material Technology: Developments such as halogen-free materials or polyimide films address both performance and environmental compliance challenges.
• Increasing Infrastructure of 5G: The rollout of 5G necessitates PCBs that offer improved signal integrity and thermal management, which is driving innovation in rigid 1-2 sided designs.
• Emphasis on Environmentally Friendly Manufacturing: Regulatory forces and consumer attitudes toward sustainable electronics are compelling a transition toward recyclable materials and greener production processes. Challenges in the rigid 1-2 sided in the global PCB market include:
• Higher Material Costs: Expensive materials such as epoxy resins and polyimide films increase costs, making it less feasible for smaller manufacturers.
• Stringent Regulatory Compliance: Changing environmental regulations like RoHS and REACH require significant investment in material innovations and testing.
• Dependence on Global Suppliers: The market depends on global suppliers for raw materials and components, making it vulnerable to geopolitical and economic uncertainties.
• R&D Barriers: The production of high-performance PCBs involves significant R&D efforts, which may act as a barrier for smaller players.
• Competition from Flexible and Multilayer PCBs: Flexible PCBs and multilayer solutions compete with rigid 1-2 sided PCBs, limiting growth in specific applications. While miniaturization, advancements in materials, and eco-friendly trends propel the rigid 1-2 sided PCB market, high costs and regulatory pressures pose challenges. Strategic innovation and collaboration are needed to overcome these barriers and shape the future of the market.
• Nippon Mektron
• TTM Technologies
• Unimicron Technology
• Epec
• Compeq Manufacturing
• Technology Maturity: Glass fabric and epoxy resin are highly mature technologies, with wide adoption across different industries because they are reliable and cost-effective. Polyimide films are less mature but have been growing rapidly to suit high-end applications in aerospace and 5G infrastructure. Phenolic resin and kraft paper are behind due to fewer applications and performance issues, but they are still viable for cost-sensitive markets. Under the pressures created by competitive factors, the current and future demands for epoxy and polyimide materials are better met while achieving high compliance, advanced functionality, and wide applications in the global PCB market.
• Competitive Intensity and Compliance by Regulation: Rigid 1-2 sided in the global PCB competitive intensity is strong among technologies such as epoxy resin and polyimide film due to the surging demand for high-performance PCBs. Glass fabric is widely used based on structural reliability, although newer materials like halogen-free epoxy and polyimide films lead in RoHS compliance. Phenolic resin and kraft paper are not as competitive because of their relatively lower durability and regulatory issues, limiting their applications. The increased focus of organizations on innovation and more environmentally friendly materials can provide a commercial advantage, making regulatory compliance an essential criterion in the choice of material.
• Disruption Potential: Some of the technologies in this space, such as glass fabric, epoxy resin, kraft paper, phenolic resin, and polyimide film, vary in terms of their disruption potential in the rigid 1-2 sided PCB market. Glass fabric and epoxy resin are leading due to their properties in heat dissipation and mechanical performance, which makes kraft paper and phenolic resin obsolete. Polyimide film is revolutionizing high-performance applications, offering excellent heat resistance and flexibility, and has become critical for advanced electronics. Hence, the legacy materials are less relevant, but innovation in composites helps redefine PCB design to secure stronger and more efficient applications in sectors like automotive, telecom, and consumer electronics.
• Glass Fabric
• Epoxy Resin
• Kraft Paper
• Phenolic Resin
• Polyimide Film
• Computers/Peripherals
• Communications
• Consumer Electronics
• Industrial Electronics
• Automotive
• Military/Aerospace
• Others
• North America
• Europe
• Asia Pacific
• The Rest of the World
• Latest Developments and Innovations in the Rigid 1-2 Sided in the Global PCB Technologies
• Companies / Ecosystems
• Strategic Opportunities by Technology Type
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