Close Lucintel Chat
Didn't Find What You're Looking for?
Call us at +1972 636 5056 or write at helpdesk@Lucintel.com
Ask an Expert Provide Custom Requirements Download Sample Report Search Available Reports
  • helpdesk@Lucintel.com
  • |
  • Call Lucintel +1 972 636 5056
  • |
  • Login
  • |
  • Register
  • |
  • Search
  • |
'
...

The Impact of COVID-19 is included in Technology Landscape, Trends and Semiconductor and IC Packaging Material Market. Buy it today to get an advantage.

Request the impact of COVID-19 on your product or industry


The technologies in semiconductor and IC packaging materials has undergone significant change in recent years, with traditional dual in line packaging to advanced integrated circuit packaging. The rising wave of new technologies such as grid array (GA) is creating significant potential for semiconductor and IC packaging materials in consumer electronics, aerospace and defense, and communications and telecom applications to protect and insulate electronic components from external threats.

In semiconductor and IC packaging material market, various technologies such as SOP (Small Outline Package), GA (Grid Array), QFP (Quad Flat Package), and DIP(Dual In-Line Package) technologies are used in the consumer electronics, aerospace and defense, medical devices, communications and telecom, automotive industry, and energy and lighting applications. Increasing demand for consumer electronics and increasing R&D by key players towards making the electronic packaging materials are creating new opportunities for various semiconductor and IC packaging material technologies.

Some of the latest technological developments by various countries in the semiconductor and IC packaging material market are as follows:
  • United States: Intel Corporation has initiated projects to develop advanced packaging materials for GA (Grid Array) and QFP (Quad Flat Package) technologies, aiming to enhance performance and efficiency in semiconductor devices.
  • Taiwan: Taiwan Semiconductor Manufacturing Company (TSMC) is leading initiatives to develop cutting-edge packaging materials for advanced semiconductor technologies, including SOP and GA. TSMC aims to maintain its position as a global leader in semiconductor manufacturing by enhancing packaging efficiency and performance.
  • South Korea: Samsung Electronics Co., Ltd. is investing in research and development of innovative IC packaging materials for various technologies, including QFP and DIP. Samsung aims to improve packaging density and reduce form factor to meet the demands of mobile and consumer electronics markets.
This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the semiconductor and IC packaging material market. Some insights are depicted below by a sample figure. For more details on figures, the companies researched, and other objectives/benefits on this research report, please download the report brochure.

 
Semiconductor and IC Packaging Material Technology Market
 
Semiconductor and IC Packaging Material Technology Segments

 
Semiconductor and IC Packaging Material Technology Heat Map

The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global semiconductor and IC packaging material technology by application, technology, and region as follows:

Technology Readiness by Technology Type

Competitive Intensity and Regulatory Compliance

Disruption Potential by Technology Type
 
Trends and Forecasts by Technology Type [$M shipment analysis from 2018 to 2030]:
  • SOP (Small Outline Package)
  • GA (Grid Array)
  • QFP (Quad Flat Package)
  • DIP(Dual In-Line Package)
  • Others
Technology Trends and Forecasts by Application [$M shipment analysis from 2018 to 2030]:
  • Consumer Electronics
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Aerospace and Defense
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Medical Devices
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  • Communications and Telecom
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Automotive Industry
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
  •  Energy and Lighting
    • SOP (Small Outline Package)
    • GA (Grid Array)
    • QFP (Quad Flat Package)
    • DIP(Dual In-Line Package)
    • Others
Technology Trends and Forecasts by Region [$M shipment analysis for 2018 to 2030]:
  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
  • Asia Pacific
    • Japan
    • China
    • South Korea
    • India
  • The Rest of the World

Latest Developments and Innovations in the Semiconductor and IC Packaging Material Technologies

Companies / Ecosystems

Strategic Opportunities by Technology Type
 
Some of the semiconductor and IC packaging material companies profiled in this report include Hitachi Chemical, BASF SE, Henkel AG & Company, Sumitomo Chemical, Alent, and Kyocera Chemical.

Below are the latest technological developments from top companies in the semiconductor and IC packaging material market:
  • Amkor Technology Inc. announced the development of a new generation of advanced SOP packaging materials, offering improved thermal performance and reliability for semiconductor devices in compact form factors.
  • Intel Corporation unveiled innovative GA packaging materials optimized for the high-performance computing applications, featuring enhanced signal integrity and power efficiency to meet the demands of next-generation processors.
  • Taiwan Semiconductor Manufacturing Company (TSMC) introduced breakthrough QFP packaging materials with superior electrical performance and thermal management capabilities, enabling faster and more efficient semiconductor devices.
  • Samsung Electronics Co., Ltd. announced advancements in DIP packaging materials, leveraging novel materials and manufacturing techniques to enhance durability and reliability in the automotive and industrial applications. 
This report answers following 9 key questions:
Q.1 What are some of the most promising and high-growth technology opportunities for the semiconductor and IC packaging material market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in semiconductor and IC packaging material market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in semiconductor and IC packaging material market?
Q.6 What are the latest developments in semiconductor and IC packaging material technologies? Which companies are leading these developments? 
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this semiconductor and IC packaging material market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this semiconductor and IC packaging material technology space?
Table of Contents

1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in Semiconductor and IC Packaging Material Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts analysis from 2018-2030
4.1. Semiconductor and IC Packaging Material Opportunity
4.2. Technology Trends (2018-2023) and Forecasts (2024-2030)
4.2.1. SOP (Small Outline Package)
4.2.2. GA (Grid Array)
4.2.3. QFP (Quad Flat Package)
4.2.4. DIP(Dual In-Line Package)
4.2.5. Others
4.3. Technology Trends (2018-2023) and Forecasts (2024-2030) by Application Segments
4.3.1. Consumer Electronics
4.3.1.1. SOP (Small Outline Package)
4.3.1.2. GA (Grid Array)
4.3.1.3. QFP (Quad Flat Package)
4.3.1.4. DIP(Dual In-Line Package)
4.3.1.5. Others
4.3.2. Aerospace and Defense
4.3.2.1. SOP (Small Outline Package)
4.3.2.2. GA (Grid Array)
4.3.2.3. QFP (Quad Flat Package)
4.3.2.4. DIP(Dual In-Line Package)
4.3.2.5. Others
4.3.3. Medical Devices
4.3.3.1. SOP (Small Outline Package)
4.3.3.2. GA (Grid Array)
4.3.3.3. QFP (Quad Flat Package)
4.3.3.4. DIP(Dual In-Line Package)
4.3.3.5. Others
4.3.4. Communications and Telecom
4.3.4.1. SOP (Small Outline Package)
4.3.4.2. GA (Grid Array)
4.3.4.3. QFP (Quad Flat Package)
4.3.4.4. DIP(Dual In-Line Package)
4.3.4.5. Others
4.3.5. Automotive Industry
4.3.5.1. SOP (Small Outline Package)
4.3.5.2. GA (Grid Array)
4.3.5.3. QFP (Quad Flat Package)
4.3.5.4. DIP(Dual In-Line Package)
4.3.5.5. Others
4.3.6. Energy and Lighting
4.3.6.1. SOP (Small Outline Package)
4.3.6.2. GA (Grid Array)
4.3.6.3. QFP (Quad Flat Package)
4.3.6.4. DIP(Dual In-Line Package)
4.3.6.5. Others

5. Technology Opportunities (2018-2030) by Region
5.1. Semiconductor and IC Packaging Material Market by Region
5.2. North American Semiconductor and IC Packaging Material Market
5.2.1. United States Semiconductor and IC Packaging Material Market
5.2.2. Canadian Semiconductor and IC Packaging Material Market
5.2.3. Mexican Semiconductor and IC Packaging Material  Market
5.3. European Semiconductor and IC Packaging Material Market
5.3.1. The United Kingdom Semiconductor and IC Packaging Material Market
5.3.2. German Semiconductor and IC Packaging Material Market
5.3.3. French Semiconductor and IC Packaging Material Market
5.4. APAC Semiconductor and IC Packaging Material Market
5.4.1. Chinese Semiconductor and IC Packaging Material Market
5.4.2. Japanese Semiconductor and IC Packaging Material Market
5.4.3. Indian Semiconductor and IC Packaging Material Market
5.4.4. South Korean Semiconductor and IC Packaging Material Market
5.5. ROW Semiconductor and IC Packaging Material Technology Market

6. Latest Development and Innovation in Semiconductor and IC Packaging Material Technologies

7. Companies / Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the Semiconductor and IC Packaging Material Market by Technology
8.2.2. Growth Opportunities for the Semiconductor and IC Packaging Material Market by Application
8.2.3. Growth Opportunities for the Semiconductor and IC Packaging Material Market by Region
8.3. Emerging Trends in the Semiconductor and IC Packaging Material Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the Semiconductor and IC Packaging Material Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the Semiconductor and IC Packaging Material Market

9. Company Profiles of Leading Players            
9.1. Hitachi Chemical
9.2. BASF SE
9.3. Henkel AG & Company
9.4. Sumitomo Chemical
9.5. Alent
9.6. Kyocera Chemical
.

Buy full report or by chapter as follows

Price by License Type:
[-] Hide Chapter Details
[Chapter Number] [Chapter Name] [Chapter Number Of Pages] [Chapter Price]
Title/Chapter Name Pages Price
Full Report: Technology Landscape, Trends and Opportunities in the Global Semiconductor and IC Packaging Material Market Full Report $ 4,850
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

Please sign in below to get report brochure - Technology Landscape, Trends and Opportunities in the Global Semiconductor and IC Packaging Material Market.

At Lucintel, we respect your privacy and maintain the confidentiality of information / data provided by you
(Please enter your corporate email. * These fields are mandatory )
Have an Account / Returning Visitors?

Follow us on