Table of Contents
1. Executive Summary
2. Standard Multilayers in the Global PCB Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Standard Multilayers in the Global PCB Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Standard Multilayers in the Global PCB Market by Product Type
3.3.1: Layer 3-6
3.3.2: Layer 8-10
3.3.3: Layer 10+
3.4: Standard Multilayers in the Global PCB Market by End Use Industry
3.4.1: Computers/Peripheral
3.4.2: Communication
3.4.3: Consumer Electronics
3.4.4: Industrial Electronics
3.4.5: Automotive
3.4.6: Military/Aerospace
3.4.7: Others
4. Market Trends and Forecast Analysis by Region from 2017 to 2028
4.1: Standard Multilayers in the Global PCB Market by Region
4.2: Standard Multilayers in the North American PCB Market
4.2.1: Standard Multilayers in the North American PCB Market by Product Type: Layer 3-6, Layer 8-10, and Layer 10+
4.2.2: Standard Multilayers in the North American PCB Market by End Use Industry: Computer/Peripheral, Communication, Consumer Electronics, Industrial Electronics, Automotive, Military/Aerospace, and Others
4.3: Standard Multilayers in the European PCB Market
4.3.1: Standard Multilayers in the European PCB Market by Product Type: Layer 3-6, Layer 8-10, and Layer 10+
4.3.2: Standard Multilayers in the European PCB Market by End Use Industry: Computer/Peripheral, Communication, Consumer Electronics, Industrial Electronics, Automotive, Military/Aerospace, and Others
4.4: Standard Multilayers in the APAC PCB Market
4.4.1: Standard Multilayers in the APAC PCB Market by Product Type: Layer 3-6, Layer 8-10, and Layer 10+
4.4.2: Standard Multilayers in the APAC PCB Market by End Use Industry: Computer/Peripheral, Communication, Consumer Electronics, Industrial Electronics, Automotive, Military/Aerospace, and Others
4.5: Standard Multilayers in the ROW PCB Market
4.5.1: Standard Multilayers in the ROW PCB Market by Product Type: Layer 3-6, Layer 8-10, and Layer 10+
4.5.2: Standard Multilayers in the ROW PCB Market by End Use Industry: Computer/Peripheral, Communication, Consumer Electronics, Industrial Electronics, Automotive, Military/Aerospace, and Others
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for Standard Multilayers in the Global PCB Market by Product Type
6.1.2: Growth Opportunities for Standard Multilayers in the Global PCB Market by End Use Industry
6.1.3: Growth Opportunities for Standard Multilayers in the Global PCB Market by Region
6.2: Emerging Trends in Standard Multilayers in the Global PCB Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of Standard Multilayer Companies in the Global PCB Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in Standard Multilayers in the Global PCB Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Flexium Interconnect
7.2: Fujikura
7.3: Nippon Mektron
7.4: TTM Technologies
7:5: Zhen Ding Tech