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Semiconductor Packaging Material Market Trends and Forecast

The future of the global semiconductor packaging material market looks promising with opportunities in the consumer electronics, aerospace & defense, healthcare, communication, and automotive industries. The global semiconductor packaging material market is expected to reach an estimated $50.6 billion by 2028 with a CAGR of 7.1% from 2023 to 2028. The major drivers for this market are growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
Semiconductor Packaging Material Market by Product, Technology, and End Use Industry
A more than 150-page report is developed to help in your business decisions.  Sample figures with some insights are shown below. 
Semiconductor Packaging Material Market by Segments

Semiconductor Packaging Material Market by Segment

The study includes a forecast for the global semiconductor packaging material market by product type, technology, end use industry, and region, as follows:

Semiconductor Packaging Material Market by Product Type [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Substrates
  • Leadframes
  • Bonding Wires
  • Encapsulants
  • Underfill Materials
  • Die Attach
  • Solder Balls
  • Wafer Level Packaging Dielectrics
  • Others

Semiconductor Packaging Material Market by Technology [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Grid Array
  • Small Outline Package
  • Dual Flat No-Leads
  • Quad Flat Package
  • Dual In-Line Package
  • Others

Semiconductor Packaging Material Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Consumer Electronics
  • Aerospace & Defense
  • Healthcare
  • Communication
  • Automotive
  • Others

Semiconductor Packaging Material Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Packaging Material Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor packaging material companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor packaging material companies profiled in this report include. 

Semiconductor Packaging Material Market Insights

  • Lucintel forecasts that substrate will remain the largest segment over the forecast period due to the growing demand for system-in-package (SIP) and high-performance devices and rising usage of this product to transmit electricity from the semiconductor to the mainboard and secure the semiconductor from external damage.
  • Consumer electronics is expected to witness the highest growth over the forecast period due to the increasing number of demand for smartphones and significant use of semiconductor packing in the electronic products. 
  • Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the high demand for electronic packaging materials and for consumer electronics in China, Taiwan, and India.

Features of the Semiconductor Packaging Material Market

  • Market Size Estimates: Semiconductor packaging material market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Semiconductor packaging material market size by various segments, such as by product type, technology, end use industry, and region
  • Regional Analysis: Semiconductor packaging material market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by product type, technology, end use industry, and regions for the semiconductor packaging material market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the semiconductor packaging material market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the semiconductor packaging material market size?
Answer: The global semiconductor packaging material market is expected to reach an estimated $50.6 billion by 2028.
Q2. What is the growth forecast for semiconductor packaging material market?
Answer: The global semiconductor packaging material market is expected to grow with a CAGR of 7.1% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of the semiconductor packaging material market?
Answer: The major drivers for this market are growing trend of miniaturization of the electronic devices across the world and high demand for mobile phones, tablets, and other communication devices.
Q4. What are the major segments for semiconductor packaging material market?
Answer: The future of the semiconductor packaging material market looks promising with opportunities in the consumer electronics, aerospace & defense, healthcare, communication, and automotive industries.
Q5. Who are the key semiconductor packaging material companies?
Answer: Some of the key semiconductor packaging material companies are as follows:
  • Henkel
  • Hitachi Chemical Company
  • Sumitomo Chemical
  • Kyocera Chemical
  • Toray Industries
Q6. Which semiconductor packaging material segment will be the largest in future?
Answer: Lucintel forecasts that substrate will remain the largest segment over the forecast period due to the growing demand for system-in-package (SIP) and high-performance devices and rising usage of this product to transmit electricity from the semiconductor to the mainboard and secure the semiconductor from external damage.
Q7. In semiconductor packaging material market, which region is expected to be the largest in next 5 years?
Answer: Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the high demand for electronic packaging materials and for consumer electronics in China, Taiwan, and India.
Q8. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

Q.1. What are some of the most promising, high-growth opportunities for the semiconductor packaging material market by product type (substrates, leadframes, bonding wires, encapsulants, underfill materials, die attach, solder balls, wafer-level package dielectrics, and others), technology (grid array, small outline package, dual flat no-leads, quad flat package, dual in-line package, and others), end use industry (consumer electronics, aerospace & defense, healthcare, communication, automotive, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7.  What are some of the changing demands of customers in the market?
Q.8.  What are the new developments in the market? Which companies are leading these developments?
Q.9.  Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

For any questions related to semiconductor packaging material market or related to semiconductor packaging material companies, semiconductor packaging material market size, semiconductor packaging material market share, semiconductor packaging material analysis, semiconductor packaging material market growth, semiconductor packaging material market research, write Lucintel analyst at email: helpdesk@lucintel.com we will be glad to get back to you soon.
Table of Contents
 
1. Executive Summary
 
2. Global Semiconductor Packaging Material Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Global Semiconductor Packaging Material Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Global Semiconductor Packaging Material Market by Product Type
3.3.1: Substrates
3.3.2: Leadframes
3.3.3: Bonding Wires
3.3.4: Encapsulants
3.3.5: Underfill Materials
3.3.6: Die Attach
3.3.7: Solder Balls
3.3.8: Wafer Level Packaging Dielectrics 
3.3.9: Others 
3.4: Global Semiconductor Packaging Material Market by Technology
3.4.1: Grid Array
3.4.2: Small Outline Package
3.4.3: Dual Flat No-Leads
3.4.4: Quad Flat Package
3.4.5: Dual In-Line Package
3.4.6: Others
3.5: Global Semiconductor Packaging Material Market by End Use Industry
3.5.1: Consumer Electronics
3.5.2: Aerospace & Defense
3.5.3: Healthcare
3.5.4: Communication   
3.5.5: Automotive
3.5.6: Others
 
4. Market Trends and Forecast Analysis by Region from 2017 to 2028
4.1: Global Semiconductor Packaging Material Market by Region
4.2: North American Semiconductor Packaging Material Market
4.2.1: North American Semiconductor Packaging Material Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Level Package Dielectric, and Others
4.2.2: North American Semiconductor Packaging Material Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.3: European Semiconductor Packaging Material Market
4.3.1: European Semiconductor Packaging Material Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Level Package Dielectric, and Others
4.3.2: European Semiconductor Packaging Material Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.4: APAC Semiconductor Packaging Material Market 
4.4.1: APAC Semiconductor Packaging Material Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Level Package Dielectric, and Others
4.4.2: APAC Semiconductor Packaging Material Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
4.5: ROW Semiconductor Packaging Material Market 
4.5.1: ROW Semiconductor Packaging Material Market by Product Type: Substrates, Leadframe, Bonding Wires, Encapsulants, Underfill Materials, Die Attach, Solder Balls, Wafer-Level Package Dielectric, and Others
4.5.2: ROW Semiconductor Packaging Material Market by End Use Industry: Consumer Electronics, Aerospace & Defense, Healthcare, Communication, Automotive, and Others
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Semiconductor Packaging Material Market by Product Type 
6.1.2: Growth Opportunities for the Global Semiconductor Packaging Material Market by Technology 
6.1.3: Growth Opportunities for the Global Semiconductor Packaging Material Market by End Use Industry
6.1.4: Growth Opportunities for the Global Semiconductor Packaging Material Market by Region
6.2: Emerging Trends in the Global Semiconductor Packaging Material Market 
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Semiconductor Packaging Material Market 
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Packaging Material Market 
6.3.4: Certification and Licensing
 
7. Company Profiles of Leading Players
7.1: Henkel
7.2: Hitachi Chemical Company
7.3: Sumitomo Chemical
7.4: Kyocera Chemical 
7:5: Toray Industries
 

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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