Semiconductor Bonder Market Trends and Forecast
The future of the global semiconductor bonder market looks promising with opportunities in the integrated device manufacturer (IDMs) and outsourced semiconductor assembly and test (OSATs) markets. The global semiconductor bonder market is expected to grow with a CAGR of 4.7% from 2024 to 2030. The major drivers for this market are rising demand for consumer electronics, advancements in semiconductor manufacturing, and increasing adoption of IoT devices.
• Lucintel forecasts that wire bonder is expected to witness higher growth over the forecast period.
• Within this market, integrated device manufacturer (IDMs) is expected to witness the higher growth.
• APAC is expected to witness the highest growth over the forecast period.
Country Wise Outlook for the Semiconductor Bonder Market
• United States: In 2023, Intel announced a $20 billion investment in new semiconductor bonding facilities in Ohio, aiming to enhance production capabilities. The U.S. government launched the CHIPS Act, offering $52 billion in subsidies to boost domestic semiconductor manufacturing.
• China: SMIC expanded its semiconductor bonding capacity with a new plant in Shenzhen, aiming to increase output by 40% by 2025. The Chinese government introduced incentives for local semiconductor firms to reduce reliance on foreign technology.
• South Korea: Samsung committed $17 billion to build a cutting-edge semiconductor bonding facility in Pyeongtaek by 2024. The South Korean government unveiled a $450 billion plan to support the semiconductor industry over the next decade.
• Germany: Infineon Technologies announced a €1.6 billion investment to expand its semiconductor bonding operations in Dresden, targeting a 30% increase in production by 2026. The German government provided substantial grants to strengthen the countryÄX%$%Xs semiconductor supply chain.
A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.
Semiconductor Bonder Market by Segment
The study includes a forecast for the global semiconductor bonder market by type, application, and region.
Semiconductor Bonder Market by Type [Value from 2018 to 2030]:
• Wire Bonder
• Die Bonder
Semiconductor Bonder Market by Application [Value from 2018 to 2030]:
• Integrated Device Manufacturer (IDMs)
• Outsourced Semiconductor Assembly & Test (OSATs)
Semiconductor Bonder Market by Region [Value from 2018 to 2030]:
• North America
• Europe
• Asia Pacific
• The Rest of the World
List of Semiconductor Bonder Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor bonder companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor bonder companies profiled in this report include-
• ASM Pacific Technology
• Kulicke& Soffa
• Palomar Technologies
• DIAS Automation
• F&K Delvotec Bondtechnik
• Hesse
• Hybond
Recent Development in the Semiconductor Bonder Market
• Kulicke & Soffa Industries, Inc.: Kulicke & Soffa Industries launched its latest semiconductor bonder model, the Asterion™ Evo, which integrates advanced AI capabilities for enhanced precision and speed. This innovation aims to improve productivity and reduce operational costs for semiconductor manufacturers.
• ASM Pacific Technology Limited: ASM Pacific Technology introduced its new high-speed, high-accuracy bonding solution, the AD830P, designed for advanced packaging applications. This system supports the growing demand for miniaturized and complex semiconductor devices, enhancing performance and reliability.
• BE Semiconductor Industries N.V. (Besi): Besi announced a strategic partnership with a leading semiconductor company to develop next-generation die bonding technology. This collaboration focuses on creating more efficient and cost-effective solutions for high-volume semiconductor production.
• Palomar Technologies, Inc.: Palomar Technologies expanded its product line with the Palomar 3880-II Die Bonder, which features state-of-the-art vision systems and software enhancements. This product aims to meet the increasing requirements for precision and flexibility in semiconductor assembly processes.
• Hesse GmbH: Hesse GmbH launched the Bondjet BJ985, an ultrasonic wire bonder tailored for high-density interconnects and fine-pitch applications. The new model offers improved automation capabilities and process stability, catering to the needs of modern semiconductor manufacturing.
Features of the Global Semiconductor Bonder Market
Market Size Estimates: Semiconductor bonder market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Semiconductor bonder market size by type, application, and region in terms of value ($B).
Regional Analysis: Semiconductor bonder market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the semiconductor bonder market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor bonder market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
FAQ
Q1. What is the growth forecast for semiconductor bonder market?
Answer: The global semiconductor bonder market is expected to grow with a CAGR of 4.7% from 2024 to 2030.
Q2. What are the major drivers influencing the growth of the semiconductor bonder market?
Answer: The major drivers for this market are rising demand for consumer electronics, advancements in semiconductor manufacturing, and increasing adoption of IoT devices.
Q3. What are the major segments for semiconductor bonder market?
Answer: The future of the semiconductor bonder market looks promising with opportunities in the integrated device manufacturer (IDMs) and outsourced semiconductor assembly and test (OSATs) markets.
Q4. Who are the key semiconductor bonder market companies?
Answer: Some of the key semiconductor bonder companies are as follows:
• ASM Pacific Technology
• Kulicke& Soffa
• Palomar Technologies
• DIAS Automation
• F&K Delvotec Bondtechnik
• Hesse
• Hybond
Q5. Which semiconductor bonder market segment will be the largest in future?
Answer: Lucintel forecasts that wire bonder is expected to witness higher growth over the forecast period.
Q6. In semiconductor bonder market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness the highest growth over the forecast period.
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.
This report answers following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for the semiconductor bonder market by type (wire bonder and die bonder), application (integrated device manufacturer (IDMs) and outsourced semiconductor assembly & test (OSATs)), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
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