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Radiation Hardened Electronics Trends and Forecast

The future of the global radiation hardened electronics market looks promising with opportunities in the space, aerospace & defense, nuclear power plant, and medical markets. The global radiation hardened electronics market is expected to reach an estimated $2.1 billion by 2030 with a CAGR of 3.6% from 2024 to 2030. The major drivers for this market are rising intelligence, surveillance, and reconnaissance (ISR) activities, technology advancements in multicore processors used for military and space-grade applications, and increasing demand for radiation-hardened electronics in commercial satellites.
• Lucintel forecasts that power management will remain the largest segment over the forecast period as it delivers excellent durability against high-energy-charged particles and ionizing radiation that drives their demand in outer space requirements.
• Within this market, space will remain the largest segment due to the rising number of ISR operations along with the increasing number of space missions.
• North America will remain the largest region over the forecast period due to growing adoption of advanced technologies and miniaturization of components and existence of rad-hard component manufacturers in the region.
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Radiation Hardened Electronics Trends and Forecast

Radiation Hardened Electronics by Segment

Emerging Trends in the Radiation Hardened Electronics Market

This particular emerging trend that involves the development of radiation-hardened electronics designates new high reliability components for the space and defense industries. These include improving performance, combining new technologies, and increasing cost efficiency.
• Advanced Materials: Radiation tolerant electronics are usually equipped with new materials like radiation tolerant semiconductor and insulation materials which enhances the life span of radiation-hardened electronics. Such materials assist in preventing radiation destructive effects and extending the useful life of the electronics in space and military applications.
• Enhanced Manufacturing Techniques: Advanced electron devices are being manufactured using precision fabrication and partial processing which is also progressively improving the radiation hardness of the electronic devices. Advanced techniques provide better and tougher components which helps in sustaining longer ends in radiation rich places.
• Integration with Space Missions: The growing reliance of radiation-hardened electronics for space missions indicates a trend towards reliability and performance enhancement for efficiency in space exploration. This trend extends the construction of better electronic systems that can operate in outer space where conditions cannot be maligned.
• Development of Hybrid Technologies: Interdisciplinary technology that incorporates research and development of radiation hard electronic systems and technologies for instance artificial intelligence and machine learning is taking shape. These hybrids are complimentary to the operation and flexibility of the electronic systems in the high radiation environments and thereby improving overall mission accomplishment.
• Cost Reduction Strategies: There is a growing trend to seek measures that will help limit the pricing of radiation hard electronics. Changes in design and processes of construction are rendering high end units cheaper and limiting their employment to military and commercial activities.
It is evident that these trends tend to advance, advanced materials, advanced manufacturing processes, merging with the space missions, more advanced hybrid technologies and more strategies towards cost reduction work have been changing the picture of the radiation hardened electronics market. They enhance how these components operate, how reliable they are and how economics effective they are in high radiation environments.
Emerging Trends in the Radiation Hardened Electronics Market

Recent Developments in the Radiation Hardened Electronics Market

The recent highlights of the significant developments concerning radiation-hardened electronics focus on current materials and construction as well as prospects for the use of such materials and construction. These have been making the electronic parts more effective and dependable in harsh radiation environments.
• Improved Semiconductor Materials: Recently, the progress made in the area of semiconductors in terms of radiation stable silicon and radiation resistant compound semiconductors has contributed towards improving the resiliency of radiation hard electronics. These materials can prevent some of radiation damage and improve the product life.
• Advanced means of shielding from radiation: With the invention of affordable materials for manufacturing the modules and advanced designs, it becomes easier to shield the electronic parts venturing into new horizons. Such abilities improve the performance of devices and their usage in high radiation areas conducive for space and defense purposes.
• Enhanced Testing and Verification Methods: The conventional systems of testing and verification of radiation hardened electronics systems are changing for better and assuring finer performance and reliability. New developments of testing systems and models are in use to evaluate the radiation limits of components before use.
• Integration of AI and Automation: Concurrent advancements in artificial intelligence and automation in the design and production of radiation hard electronics is improving productivity. AI design instruments coupled with automated manufactures are enhancing the systems and reliability of electronic devices.
• Expansion of Commercial Applications: The uptake of radhard electronics to cover civilian markets such as high altitude aviation and satellite communications demonstrates need for robust components. This tendency is stimulating radiation hardened technologies innovation and costs minimization.
Progress has been made in the field of radiation-hardened electronics in the form of modification of semiconductor materials, incorporation of radiation shielding techniques, advancement of testing methods, and use of AI as well as their commercialization, hence the component performance and reliability improvements. These developments are necessary for the use of high-reliability systems in difficult conditions.

Strategic Growth Opportunities for Radiation Hardened Electronics Market

Strategic growth opportunities in radiation hard electronics are being reported in different applications with the widespread of the technology along with growing demands for high reliability components.
• Space Exploration: Increased interest in the area of space exploration provides the possibility for market for radiation hardened electronics to be used in space missions which operate in extreme environmental conditions. Advancements in the design and material of components are improving the performance and reliability of satellites, space probes and other space4 bound equipments.
• Defense Applications: Rising military budgets together with the need for dependable electronic systems in defense applications increase the market for radiation-hardened electronics. They are essential for communications, navigation, and weapon systems where radiation levels are high.
• High-Altitude Aviation: The growth of high-altitude aviation and unmanned aerial vehicles (UAVs) opens up new markets for radiation-hardened electronics. High-radiation levels due to high altitude require components that can tolerate this radiation without compromising system safety or effectiveness.
• Nuclear Power Plants: The specialization to withstand radiation is also put into use for the control systems and the monitoring equipment used in a nuclear power plant. The provision of increased toughness and the ability to perform in these settings become imperative.
• Medical Imaging: Electronics that are ruggedized for radiation bombardment are being deployed within the medical imaging systems such as CT scanners and radiosurgery devices. They foster better performance that brings in good diagnostic results and patient management.
Strategic growth opportunities in radiation hardening electronics include exploration of space, defense sector, flying at a high altitude, nuclear power plants, and medical imaging. These opportunities respond to the growth in the need for reliable components in harsh conditions increasing the drive for new ideas and further growth of the market.

Radiation Hardened Electronics Market Driver and Challenges

The radiation-hardened electronics market is affected by several factors that drive or retard the market which include technological and economic factors as well as regulatory factors. These factors determine the uptake and composition of certain high-reliability parts.
The factors responsible for driving the radiation hardened electronics market include:
1. Technological Advancements: Growth in radiation hardened electronics is influenced by continual development of semiconductor materials as well as developments in radiation shielding technologies. These improvements increase the performance, usability, and the reliability of devices in high radiation hazards.
2. Increased Space Exploration: The growing interest in space exploration and satellite missions includes the increase in the demand for those electronics, which are radiation-hardened. It is a given that there is a need for space radiation tolerant components for successful missions and long duration operations.
3. Defense Sector Investments: Higher value contracts inflow in the defense sector when the investment size on the high reliability systems increases. There is increasing demand for reliable components for military purposes such as communication systems and navigation systems in radiation environments.
4. Growing Demand for High-Altitude Applications: Development of high altitude aviation and UAVs has led to an increased requirement of radiation hard electronics. It is critical to ensure reliability of components while operating in high altitude environments to achieve reliability of the system.
5. Advancements in Testing Methods: Development of testing and/or verification methods leads to enhanced reliability of radiation hard electronics. Enhanced testing methods guarantee that components will be able to work in situated with high levels of radiation.
Challenges in the radiation hardened electronics market are:
1. High Development Costs: The development and production of radiation hardened electronics is often hampered by costs. These manufacturing costs are exerted on the manufacturers and as a result, the prices of advanced components may not be affordable.
2. Technical Complexity: Radiation hardened electronics are faced with the challenges of technical difficulties, which pertain to the design and materials used to make them especially in engineering and manufacturing. It is very important in improving the performance and reliability of components, to tackle these complexities.
3. Supply Chain Issues: The critical supply chain constrains, for instance lack of essential materials or components can affect the production and availability of radiation affected electronics for sale in the market. Market dynamics as are driven by the availability of supplies in the supply chain, imply that all constraints should be managed in the best possible way they can be.
The radiation hardening electronic spacing market is determined by technological factors and rising interest toward space exploration and defense industries while encountering such barriers as high costs of development, technical difficulties, the supply chain issues. Solving these challenges is very important in moving forward in strengthening the technology and its effectiveness in different places further.

List of Radiation Hardened Electronics Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies radiation hardened electronics companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the radiation hardened electronics companies profiled in this report include-
• Microchip Technology
• BAE Systems
• Renesas Electronics Corporation
• Infineon Technologies
• STMicroelectronics
• Xilinx
• Texas Instruments Incorporated
• Honeywell International
• Teledyne Technologies
• TTM Technologies

Radiation Hardened Electronics by Segment

The study includes a forecast for the global radiation hardened electronics by component, manufacturing technique, product type, application, and region

Radiation Hardened Electronics Market by Component [Analysis by Value from 2018 to 2030]:


• Mixed Signal ICs
• Processors & Controllers
• Memory
• Power Management

Radiation Hardened Electronics Market by Manufacturing Technique [Analysis by Value from 2018 to 2030]:


• Radiation-Hardening by Design (RHBD)
• Radiation-Hardening by Process (RHBP)

Radiation Hardened Electronics Market by Product Type [Analysis by Value from 2018 to 2030]:


• Commercial-off-the-Shelf (COTS)
• Custom Made

Radiation Hardened Electronics Market by Application [Analysis by Value from 2018 to 2030]:


• Space
• Aerospace & Defense
• Nuclear Power Plant
• Medical
• Others

Radiation Hardened Electronics Market by Region [Analysis by Value from 2018 to 2030]:


• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Radiation Hardened Electronics Market

Major players in the market are expanding their operations and forming strategic partnerships to strengthen their positions. Below image highlights recent developments by major Radiation Hardened Electronics producers in key regions: the USA, China, India, Japan, and Germany
• United States: In the U.S, the development of radiation harden electronic is attributed to the increased allocation of resource hare to space and military activities. Such Optimization includes increased radiation tolerance to microprocessors and memories or better mechanical structure and manufacturing systems for harsh environment applications.
• China: Development of China radiation hardened electronics is oriented internally to increase the reliability of their components for space and military missions. Such achievements include the use of modern radiation protection materials on and the increasing the radiation endurance of the microelectronics via new semiconductor process techniques.
• Germany: Collaboration between industry and research entities in Germany also enabled the improvement of radiation hard electronics. In field was, Key improvements were adoption of practices that minimize the amounts of radiation damaging the semiconductors and synthesis of polymers that high radiation environments for avionics and defense.
• India: In India, the primary focus of the timely developments in radiation-hardened electronics has been components used in space and satellite applications. New developments comprise low cost radiation hardening techniques and international cooperation in specialized space agencies which seek towards factors that enhance quality and reliability of electronic systems.
• Japan: Looking at the prospects of Japan, this country is still developing radiation-hardened electronics coupling advances in semiconductors technologies and materials. One recent example is the development of radiation hardened integrated circuits for a space missions and for applications in severe heights which incorporates novel materials and manufacturing technologies for improved performance and dependability.

Features of the Global Radiation Hardened Electronics Market

Market Size Estimates: Radiation hardened electronics market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Radiation hardened electronics market size by various segments, such as by component, manufacturing technique, product type, application, and region in terms of value ($B).AV36:AV54
Regional Analysis: Radiation hardened electronics market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different components, manufacturing techniques, product types, applications, and regions for the radiation hardened electronics market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the radiation hardened electronics market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

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FAQ

Q.1 What is the radiation hardened electronics market size?
Answer: The global radiation hardened electronics market is expected to reach an estimated $2.1 billion by 2030.
Q.2 What is the growth forecast for radiation hardened electronics market?
Answer: The global radiation hardened electronics market is expected to grow with a CAGR of 3.6% from 2024 to 2030.
Q.3 What are the major drivers influencing the growth of the radiation hardened electronics market?
Answer: The major drivers for this market are rising intelligence, surveillance, and reconnaissance (ISR) activities, technology advancements in multicore processors used for military and space-grade applications, and increasing demand for radiation-hardened electronics in commercial satellites.
Q4. What are the major segments for radiation hardened electronics market?
Answer: The future of the radiation hardened electronics market looks promising with opportunities in the space, aerospace & defense, nuclear power plant, and medical markets.
Q5. Who are the key radiation hardened electronics market companies?
Answer: Some of the key radiation hardened electronics companies are as follows:
• Microchip Technology
• BAE Systems
• Renesas Electronics Corporation
• Infineon Technologies
• STMicroelectronics
• Xilinx
• Texas Instruments Incorporated
• Honeywell International
• Teledyne Technologies
• TTM Technologies
Q6. Which radiation hardened electronics market segment will be the largest in future?
Answer: Lucintel forecasts that power management will remain the largest segment over the forecast period as it delivers excellent durability against high-energy-charged particles and ionizing radiation that drives their demand in outer space requirements.
Q7. In radiation hardened electronics market, which region is expected to be the largest in next 5 years?
Answer: North America will remain the largest region over the forecast period due to growing adoption of advanced technologies and miniaturization of components and existence of rad-hard component manufacturers in the region.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the radiation hardened electronics market by component (mixed signal ICs, processors & controllers, memory, and power management), manufacturing technique (radiation-hardening by design (RHBD), and radiation-hardening by process (RHBP)), product type (commercial-off-the-shelf (COTS), and custom made), application (space, aerospace & defense, nuclear power plant, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
For any questions related to radiation hardened electronics market or related to radiation hardened electronics companies, radiation hardened electronics market size, radiation hardened electronics market share, radiation hardened electronics market growth, radiation hardened electronics market research, write Lucintel analyst at email: helpdesk@lucintel.com we will be glad to get back to you soon.

Table of Contents

1. Executive Summary

2. Global Radiation Hardened Electronics Market : Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global Radiation Hardened Electronics Market Trends (2018-2023) and Forecast (2024-2030)

3.3: Global Radiation Hardened Electronics Market by Component
3.3.1: Mixed Signal ICs
3.3.2: Processors & Controllers
3.3.3: Memory
3.3.4: Power Management







3.4: Global Radiation Hardened Electronics Market by Manufacturing Technique
3.4.1: Radiation-Hardening by Design (RHBD)
3.4.2: Radiation-Hardening by Process (RHBP)








3.5: Global Radiation Hardened Electronics Market by Product Type
3.5.1: Commercial-off-the-Shelf (COTS)
3.5.2: Custom Made









3.6: Global Radiation Hardened Electronics Market by Application
3.6.1: Space
3.6.2: Aerospace & Defense
3.6.3: Nuclear Power Plant
3.6.4: Medical
3.6.5: Others




4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global Radiation Hardened Electronics Market by Region
4.2: North American Radiation Hardened Electronics Market
4.2.1: North American Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.2.2: North American Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others




4.3: European Radiation Hardened Electronics Market
4.3.1: European Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.3.2: European Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others





4.4: APAC Radiation Hardened Electronics Market
4.4.1: APAC Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.4.2: APAC Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others




4.5: ROW Radiation Hardened Electronics Market
4.5.1: ROW Radiation Hardened Electronics Market by Component: Mixed Signal ICs, Processors & Controllers, Memory, and Power Management
4.5.2: ROW Radiation Hardened Electronics Market by Application: Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others



5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis

6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global Radiation Hardened Electronics Market by Component
6.1.2: Growth Opportunities for the Global Radiation Hardened Electronics Market by Manufacturing Technique
6.1.3: Growth Opportunities for the Global Radiation Hardened Electronics Market by Product Type
6.1.4: Growth Opportunities for the Global Radiation Hardened Electronics Market by Application
6.1.5: Growth Opportunities for the Global Radiation Hardened Electronics Market Region

6.2: Emerging Trends in the Global Radiation Hardened Electronics Market

6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global Radiation Hardened Electronics Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Radiation Hardened Electronics Market
6.3.4: Certification and Licensing


7. Company Profiles of Leading Players
7.1: Microchip Technology
7.2: BAE Systems
7.3: Renesas Electronics Corporation
7.4: Infineon Technologies
7.5: STMicroelectronics
7.6: Xilinx
7.7: Texas Instruments Incorporated
7.8: Honeywell International
7.9: Teledyne Technologies
7.10: TTM Technologies
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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