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QFN Package Tape Market Trends and Forecast

The future of the global QFN package tape market looks promising with opportunities in the punched QFN and sawn QFN markets. The global QFN package tape market is expected to grow with a CAGR of 8.1% from 2024 to 2030. The major drivers for this market are rising demand for high-reliability and high-performance products, growing demand for precise packaging solutions, and increased demand for QFN packages in electronic devices.
• Lucintel forecasts that <50μm is expected to witness the higher growth over the forecast period.
• Within this market, punched QFN is expected to witness the higher growth.
• APAC is expected to witness highest growth over the forecast period.

QFN Package Tape Market Trends and Forecast

United States: Intel announced a collaboration with 3M to develop advanced QFN package tape solutions, supporting government initiatives for technological innovation and meeting market demand for reliable semiconductor packaging.

China: Huawei Technologies invested in upgrading its QFN packaging facilities to meet government targets for domestic semiconductor production and support the countryÄX%$%Xs semiconductor industry growth.

Japan: Hitachi Chemical Co. introduced a new line of eco-friendly QFN package tape materials, aligning with government regulations promoting sustainable manufacturing practices and reducing environmental impact in the electronics industry.

Germany: Infineon Technologies AG announced initiatives to enhance QFN package tape reliability for automotive applications, addressing government safety standards and meeting the automotive industryÄX%$%Xs stringent packaging requirements.
A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

QFN Package Tape by Segment

QFN Package Tape by Segment

The study includes a forecast for the global QFN package tape by type, application, and region.

QFN Package Tape Market by Type [Shipment Analysis by Value from 2018 to 2030]:


• <50μm
• ≥50μm

QFN Package Tape Market by Application [Shipment Analysis by Value from 2018 to 2030]:


• Punched QFN
• Sawn QFN

QFN Package Tape Market by Region [Shipment Analysis by Value from 2018 to 2030]:


• North America
• Europe
• Asia Pacific
• The Rest of the World

List of QFN Package Tape Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies QFN package tape companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the QFN package tape companies profiled in this report include-
• Tomoegawa
• Koan Hao
• Deantape
• I-PEX
• DSK Technologies
• Resonac
• Cosmo AM&T
• INNOX Advanced Materials
• Toyo Adtec
• Wenlije

Recent Development in the QFN Package Tape Market

Intel: Intel has introduced a new generation of QFN package tape solutions in collaboration with industry partners. This initiative aims to improve semiconductor packaging reliability, meeting the increasing demand for high-performance chips in electronics and automotive applications.

Samsung Electronics: Samsung Electronics has invested in research and development to enhance QFN package tape materials. The companyÄX%$%Xs initiative focuses on improving thermal conductivity and electrical performance, catering to the growing demand for advanced semiconductor packaging solutions in the global market.

3M: 3M has launched innovative QFN package tape products designed to meet the evolving needs of the electronics industry. These new tape solutions offer enhanced durability and precision, supporting the miniaturization trend and providing reliable packaging solutions for semiconductor manufacturers worldwide.

Infineon Technologies AG: Infineon Technologies AG has announced initiatives to optimize QFN package tape reliability for automotive applications. The companyÄX%$%Xs efforts aim to meet stringent industry standards and government regulations for automotive safety, ensuring high-quality packaging solutions for semiconductor devices used in vehicles.

Hitachi Chemical Co.: Hitachi Chemical Co. has introduced eco-friendly QFN package tape materials as part of its sustainability strategy. The companyÄX%$%Xs initiative aligns with global environmental regulations and market trends towards green manufacturing practices, offering semiconductor manufacturers reliable and environmentally conscious packaging options.

Features of the Global QFN Package Tape Market

Market Size Estimates: QFN package tape market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: QFN package tape market size by type, application, and region in terms of value ($B).
Regional Analysis: QFN package tape market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the QFN package tape market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the QFN package tape market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the growth forecast for QFN package tape market?
Answer: The global QFN package tape market is expected to grow with a CAGR of 8.1% from 2024 to 2030.
Q2. What are the major drivers influencing the growth of the QFN package tape market?
Answer: The major drivers for this market are rising demand for high-reliability and high-performance products, growing demand for precise packaging solutions, and increased demand for QFN packages in electronic devices.
Q3. What are the major segments for QFN package tape market?
Answer: The future of the QFN package tape market looks promising with opportunities in the punched QFN and sawn QFN markets.
Q4. Who are the key QFN package tape market companies?
Answer: Some of the key QFN package tape companies are as follows:
• Tomoegawa
• Koan Hao
• Deantape
• I-PEX
• DSK Technologies
• Resonac
• Cosmo AM&T
• INNOX Advanced Materials
• Toyo Adtec
• Wenlije
Q5. Which QFN package tape market segment will be the largest in future?
Answer: Lucintel forecasts that <50μm is expected to witness the higher growth over the forecast period.
Q6. In QFN package tape market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period.
Q7. Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

Q.1. What are some of the most promising, high-growth opportunities for the QFN package tape market by type (<50μm and ≥50μm), application (punched QFN and sawn QFN), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

For any questions related to QFN Package Tape Market Market, QFN Package Tape Market Market Size, QFN Package Tape Market Market Growth, QFN Package Tape Market Market Analysis, QFN Package Tape Market Market Report, QFN Package Tape Market Market Share, QFN Package Tape Market Market Trends, QFN Package Tape Market Market Forecast, QFN Package Tape Market Companies, write Lucintel analyst at email: helpdesk@lucintel.com. We will be glad to get back to you soon.
Table of Contents

1. Executive Summary
2. Global QFN Package Tape Market : Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges 
3. Market Trends and Forecast Analysis from 2018 to 2030
3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
3.2. Global QFN Package Tape Market Trends (2018-2023) and Forecast (2024-2030)
3.3: Global QFN Package Tape Market by Type
3.3.1: <50μm
3.3.2: ≥50μm
3.4: Global QFN Package Tape Market by Application
3.4.1: Punched QFN
3.4.2: Sawn QFN
4. Market Trends and Forecast Analysis by Region from 2018 to 2030
4.1: Global QFN Package Tape Market by Region
4.2: North American QFN Package Tape Market
4.2.1: North American QFN Package Tape Market by Type: <50μm and ≥50μm
4.2.2: North American QFN Package Tape Market by Application: Punched QFN and Sawn QFN
4.3: European QFN Package Tape Market
4.3.1: European QFN Package Tape Market by Type: <50μm and ≥50μm
4.3.2: European QFN Package Tape Market by Application: Punched QFN and Sawn QFN
4.4: APAC QFN Package Tape Market
4.4.1: APAC QFN Package Tape Market by Type: <50μm and ≥50μm
4.4.2: APAC QFN Package Tape Market by Application: Punched QFN and Sawn QFN
4.5: ROW QFN Package Tape Market
4.5.1: ROW QFN Package Tape Market by Type: <50μm and ≥50μm
4.5.2: ROW QFN Package Tape Market by Application: Punched QFN and Sawn QFN
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global QFN Package Tape Market by Type
6.1.2: Growth Opportunities for the Global QFN Package Tape Market by Application
6.1.3: Growth Opportunities for the Global QFN Package Tape Market by Region
6.2: Emerging Trends in the Global QFN Package Tape Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global QFN Package Tape Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global QFN Package Tape Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Tomoegawa
7.2: Koan Hao
7.3: Deantape
7.4: I-PEX
7.5: DSK Technologies
7.6: Resonac
7.7: Cosmo AM&T
7.8: INNOX Advanced Materials
7.9: Toyo Adtec
7.10: Wenlije
.

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Full Report: QFN Package Tape Market Report: Trends, Forecast and Competitive Analysis to 2030 Full Report $ 4,850
A 150 Page Report
Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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