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The future of the molded interconnected device market looks promising with opportunities in the automotive, medical, telecommunication, industrial, and consumer electronics industries. The global molded interconnected device market is expected to grow with a CAGR of 14% to 16% from 2021 to 2026. The major drivers for this market are increasing demand of miniaturization in consumer electronics segment, increasing use in medical device, and increase in the penetration of automation around all industrial verticals.
A more than 150 page report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of molded interconnected device market report download the report brochure.
The study includes trends and forecast for the global molded interconnected device market by process, product type, end use industry, and region as follows:
By Process [$M shipment analysis for 2015 – 2026]:
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Laser Direct Structuring
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2-Shot Molding
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Film Techniques
By Product Type [$M shipment analysis for 2015 – 2026]:
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Antennae & Connectivity Modules
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Connectors & Switches
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Sensors
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Lighting
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Others
By End Use Industry [$M shipment analysis for 2015 – 2026]:
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Telecommunications
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Consumer Electronics
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Medical
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Automotive
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Industrial
By Region [$M shipment analysis for 2015 – 2026]:
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North America
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United States
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Canada
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Mexico
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Europe
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Germany
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United Kingdom
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France
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Italy
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Asia Pacific
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China
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Japan
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India
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South Korea
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The Rest of the World
Laser direct structuring will remain the largest segment due to rise in the demand of smartphone antennas and emergence of 5G mobile communication technology.
Automotive will remain the largest end use industry during the forecast period due to increasing adoption of MID in various automotive application such as steering wheel hubs, brake sensors, position sensors, and lighting.
Asia Pacific will remain the largest region during the forecast period due to increasing demand in consumer electronics industries and significant presence of major leading players of smartphones and wearable device in the APAC region.
Some of the molded interconnected device companies profiled in this report include Molex, MacDermid, Siemens, LPKF Laser & Electronics, Fujitsu, TE Connectivity, Harting, Select Connect Technologies, JOHNAN MID Solutions, 2E mechatronic, and Multiple Dimensions.
Features of Molded Interconnected Device Market
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Market Size Estimates: Molded Interconnected Device market size estimation in terms of value ($M)
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Trend and Forecast Analysis: Market trends (2015-2020) and forecast (2021-2026) by various segments and regions.
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Segmentation Analysis: Market size by product type, process, and end use industry
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Regional Analysis: Molded Interconnected Device market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
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Growth Opportunities: Analysis on growth opportunities in different end use industries, product type, process and regions for molded interconnected device market.
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Strategic Analysis: This includes M&A, new product development, and competitive landscape for the molded interconnected device market.
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Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
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This report answers following 11 key questions |
Q.1 What are some of the most promising potential, high-growth opportunities for the global molded interconnected device market by process (laser direct structuring, 2-shot molding, and film techniques), product type (antenna & connectivity modules, connectors & switches, sensors, lighting, and others), end use industry (automotive, medical, telecommunication, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the molded interconnected device market?
Q.5 What are the business risks and threats to the molded interconnected device market?
Q.6 What are emerging trends in this molded interconnected device market and the reasons behind them?
Q.7 What are some changing demands of customers in the molded interconnected device market?
Q.8 What are the new developments in the molded interconnected device market? Which companies are leading these developments?
Q.9 Who are the major players in the molded interconnected device market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the molded interconnected device market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the molded interconnected device market?
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