Molded Interconnect Device (MID) Trends and Forecast
The future of the global molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets. The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030 with a CAGR of 10.8% from 2024 to 2030. The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.
• Lucintel forecasts that, within the product type category, sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.
• Within the end use industry category, automotive is expected to witness the highest growth over the forecast period.
• In terms of regions, APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.
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Emerging Trends in the Molded Interconnect Device (MID) Market
The molded interconnect devices market is undergoing several trends that are new and changing the way things are done in the industry. These trends include new technologies, changes in market needs, or new product developments that improve the function and performance of the devices.
• Integration of Advanced Materials: The integration of advanced materials, such as high-temperature polymers and conductive inks, has emerged as a trend in the MID market. These materials offer enhanced performance features, including increased toughness, better heat resistance, and higher electrical conductivity. Their use makes it possible to achieve MIDs that are more robust and better suited for high-demand applications, such as automotive and industrial electronics.
• Miniaturization and Dense Interconnections: The trend towards miniaturization and dense interconnections is fostering the development of MID technology. When electronic devices, namely MIDs, require tighter and smaller electronic interconnections, the demand for such high-density interconnects increases. This trend enables the creation of more advanced and compact electronics, especially in consumer electronics and medical gadgets that target a more sophisticated market segment.
• Advanced 3D Molding: The advancement of 3D molding techniques with additional features will change the MID market. These techniques make it possible to manufacture complex, multi-layer MIDs where geometries are incorporated into constructed nanostructures. The use of advanced 3D molding tools ensures that ideal designs are achieved, resulting in more functional parts that enhance the performance and application range of MIDs across various industrial segments.
• Shift Toward Automotive Applications: Growing attention is directed toward the automotive applications of MIDs, attributed to the increasing complexity and reliability required from electronic systems in vehicles. MIDs are being utilized to integrate more devices inside the vehicle, such as sensors and controls, allowing advanced electronics management while decreasing the total vehicle assembly. This trend demonstrates the industryÄX%$%Xs gradual evolution towards more advanced and interconnected automotive features.
• Strategy Outline for Global Expansion: The MID market is expanding significantly in many countries, with industrialization and the demand for electronics increasing penetration in those regions. Emerging economies are allocating more funds for manufacturing capacities and technological improvements in MIDs, enabling cost containment. Recent trends make it favorable to further expand in all regions, promoting cumulative growth for the MID market and increasing opportunities for manufacturers to venture into new markets.
In addition to technological innovations in materials for MIDs, applications, and 3D molding, minimal production layouts have been implemented in the last two years. These trends have altered some physical dependencies on how molded interconnect devices behave in the long term.
Recent Developments in the Molded Interconnect Device (MID) Market
New key trends in the molded interconnect device (MID) market display the emergence of new technologies and manufacturing processes. These improvements are designed to enhance performance, functionality, and competitive pricing for these devices.
• Application of Advanced Material Scaffolds: The considerable growth in the MID sector has been supported by the use of advanced materials, such as engineering thermoplastic elastomers and conductive polymers. These materials improve the performance of MIDs, giving them a broader scope of applications in electronics, automotive, and industrial markets.
• Advancements in Cone and 3D Printing and Molding Technologies: Further advancements in 3D printing and molding have increased the importance of additive production technologies in the MID markets. New processes allow for the manufacturing of more complex and functional MIDs with higher accuracy and efficiency. These technologies enable the production of tailored, high-quality, and dependable systems that meet the needs of new electronic and automotive industries.
• Growth in Automotive MID Applications: The increase in the adoption of MIDs for automotive applications is a significant development. MIDs have increasingly been adapted for realizing electronic controls, sensors, and communication modules inside vehicles. This advancement contributes to the automotive sector’s gradual transition to more advanced and integrated systems, improving vehicle efficiency and reducing assembly complexity.
• Expansion of MID Manufacturing Capabilities in Emerging Markets: The growing need for executing MID design and structuring techniques in underserved regions is fueling market development. More facilities for production and technological advancements in areas such as China and India have reduced the costs and stock of MIDs. This advancement creates business opportunities that facilitate better market penetration and address the increasing demand for electronic components.
• Improved Design and Integration of Functionality: Improved design and functional integration in MIDs are major enhancements that have emerged in the last decade. Key innovations in the design of MIDs enable the embedding of several functions in a single element, thus eliminating the need for several separate parts and the assembly steps associated with them. This trend results in smaller, more powerful, and affordable electronic systems.
The molded interconnect device market is progressing with recent hotspots, such as performance materials, 3D printing development, further automotive penetration, increased geographical presence, and improved design integration. These developments enrich MID technology and enable effective integration across different sectors.
Strategic Growth Opportunities for Molded Interconnect Device (MID) Market
Strategic growth opportunities in the molded interconnect device (MID) market are driven by changes in technology and increased demand in several applications. Understanding and exploiting these opportunities will assist manufacturers and other relevant stakeholders in better positioning themselves according to market trends and achieving future growth.
• Development of New High-Performance Automotive MIDs: The introduction of new high-performance automotive MIDs presents a considerable opportunity for growth. As vehicle interconnectivity increases, so does the need for MIDs that integrate modules such as sensors, controls, and communication devices. The direct application of automotive MID technologies can maximize vehicle functionality and provide new market opportunities.
• Growth Strategy - Moving into Consumer Electronics: There is a significant opportunity for growth by entering the consumer electronics sector. More complex and multifunctional components, such as MIDs, have broader applications in smartphones, wearables, and home appliances. Understanding trends and developing novel MID solutions for consumer electronics is likely to help gain a competitive edge in the sector and meet the demand for compact, multifunctional parts.
• Trend – Enhancing Inclusion of 3D Printing and Customization Services: One avenue for business growth is the inclusion of 3D printing and customization services. These technologies allow for the creation of not only standard forms of MID enclosures but also elaborate custom designs for various applications. Customization services can attract a new client base and help manufacturers gain a competitive edge in the market.
• Expansion of Investment in Emerging Markets: Growth opportunities arise as investment in emerging markets increases with rising levels of industrialization and demand for electronics. The growth of manufacturing capabilities and strategic partnerships in regions such as Asia-Pacific and Latin America can boost worldwide revenue.
• Opportunity – Advancing Integration with IoT and Smart Technologies: There is potential for growth involving the integration of MIDs into Internet of Things (IoT) and smart technologies. Demand exists for MIDs that are combined with IoT and smart technologies, such as smart home solutions and industrial automation systems. This trend can foster the creation of new types of MIDs intended for these technologies.
Key growth areas in strategic alignment with the MID market include the automotive sector, growth in consumer electronics, further penetration of 3D printing, investment in emerging markets, and IoT partnerships. Capitalizing on these opportunities can lead to market expansion and a better competitive position for manufacturers.
Molded Interconnect Device (MID) Market Driver and Challenges
The molded interconnect device (MID) market, like any other market, is influenced by both positive and negative drivers and faces several challenges. Various factors define the dynamics of the market, including technology, economy, and regulation.
Factors driving the molded interconnect device (MID) market include:
• Technological Advancements in Manufacturing: Technological advancements in manufacturing, such as 3D molding and advanced materials, are key factors contributing to growth in the MID market. These new processes facilitate the development of much more complex and functional MIDs, leading to better performance and wider application ranges. The ongoing improvement of diverse technologies continues to foster market growth and product innovation.
• Growing Demand for Miniaturized Electronics: The increasing use of miniaturized electronics is a significant factor influencing the MID market. As devices become easier to use but extremely complex in size, the demand for smaller and more integrated packages increases. MIDs can bridge these gaps by housing both mechanical and electrical functions in a single part, thereby satisfying the needs of miniaturized electronics.
• Upward Trajectory of Automotive and Consumer Electronics Uses: Market growth is fueled by the expanding application of MIDs in automotive and consumer electronics. MIDs are utilized for the integration of various sensors, control devices, and communication modules in vehicles and electronic gadgets. This trend creates a demand for advanced MIDs and fosters innovation in these sectors.
Challenges in the molded interconnect device (MID) market include:
• Technological Limitations: Despite advancements, the complexity of developing MIDs can hinder progress.
• Cost of Manufacturing: High manufacturing costs and complicated processes may pose challenges to market growth.
• Lack of Awareness in Emerging Markets: There is a need for increased awareness and understanding of MIDs in emerging markets to enhance market penetration and growth.
Technological factors, demand for smaller electronic products, and the use of MIDs in automotive and consumer applications are key determinants of the MID market. Addressing high costs, complicated processes, and raising awareness in emerging markets will be crucial for future market expansion and growth.
List of Molded Interconnect Device (MID) Companies
Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies molded interconnect device (MID) companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the molded interconnect device (MID) companies profiled in this report include-
• Molex
• TE Connectivity
• Amphenol
• LPKF Laser & Electronics
• Taoglas
Molded Interconnect Device (MID) by Segment
The study includes a forecast for the global molded interconnect device (MID) by product type, process, end use industry, and region.
Molded Interconnect Device (MID) Market by Product Type [Analysis by Value from 2018 to 2030]:
• Antennae & Connectivity Modules
• Sensors
• Connectors & Switches
• Lighting Systems
• Others
Molded Interconnect Device (MID) Market by Process [Analysis by Value from 2018 to 2030]:
• Laser Direct Structuring
• Two-Shot Molding
• Film Techniques
Molded Interconnect Device (MID) Market by End Use Industry [Analysis by Value from 2018 to 2030]:
• Telecommunications
• Consumer Electronics
• Automotive
• Medical
• Industrial
• Military & Aerospace
Molded Interconnect Device (MID) Market by Region [Analysis by Value from 2018 to 2030]:
• North America
• Europe
• Asia Pacific
• The Rest of the World
Country Wise Outlook for the Molded Interconnect Device (MID) Market
The market for molded interconnect devices (MID) keeps changing lately, mostly due to new developments in technologies as well as increasing applications in various industries. Mechanical and electrical functions are incorporated into one part known as MID, which currently has a high acceptance rate since it leads to a reduction in assembly complexity and an improvement in device performance. MIDs have been identified in most of the key markets, which include China, Germany, India, and Japan recently, indicating the onset of innovation and the adoption of MIDs in consumer electronics, automotive, and industrial industries.
• United States: In the US, the molded interconnect device (MID) market has been experiencing notable advancements driven by innovations in the electronics and automotive sectors. Recent developments include increased adoption of MIDs in consumer electronics, particularly in compact devices where space and weight reduction are critical. Companies are focusing on enhancing the functionality of MIDs by integrating complex electronic circuits directly into plastic components, which improves reliability and reduces assembly costs. Advances in 3D printing and additive manufacturing are also allowing for more intricate MID designs with higher precision. Additionally, the automotive industry is adopting MIDs for their ability to streamline electronic systems and reduce the overall component count, contributing to more efficient manufacturing processes and improved vehicle performance.
• China: The Chinese MID market has benefited greatly from resources due to increased industrialization and technology. Recent developments include the introduction of more complex MIDs, advanced 3D molding technology, and hybrid injection of interconnects. Companies are developing MIDs that are more reliable and functional for low-cost electronic and vehicle applications. Due to increasing investments in research and development, new ideas are emerging that make it possible to manufacture MIDs with enhanced features at lower rates.
• Germany: Germany can be viewed as a leader in the MID industry, and therefore, producing MIDs requires an emphasis on precision and high-quality manufacturing. Recent advancements include the development of MIDs with superior integration functionality for complex electronic systems, taking engineering and technology for MIDs to another level to meet expected automotive and industrial standards. There is a growing trend of incorporating innovations such as miniaturized components and advanced materials to enhance the performance and durability of MIDs used in medical and automotive electronic applications.
• India: With the country seeking to improve its manufacturing capabilities along with higher investments in technology, it is anticipated that the MID market in India will continue to grow. Other updates involve low-cost MID manufacturing technologies and increased focus on consumer electronics and telecommunications MID applications. Indian manufacturers are looking for well-positioned medium and small enterprises for both domestic and overseas markets in terms of price and creativity. The need for more MIDs in India has been bolstered by the growth of the electronics industry in India, mediated by better functionality and performance of the devices.
• Japan: In the manufacturing of high-technology MIDs, Japan, whose main competitive advantage lies in research and development capabilities coupled with precision engineering, is still at the forefront. Recent developments comprise the use of MIDs in high-class electronics and automotive systems. Companies are investing in advanced molding technologies and new materials to make MIDs more effective and reliable. There is a trend of miniaturization and integration, which enables the realization of miniaturized and complex devices that are very important in modern-day consumer electronics and industrial automation.
Features of the Global Molded Interconnect Device (MID) Market
Market Size Estimates: Molded interconnect device (MID) market size estimation in terms of value ($B).
Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
Segmentation Analysis: Molded interconnect device (MID) market size by product type, process, end use industry, and region in terms of value ($B).
Regional Analysis: Molded interconnect device (MID) market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
Growth Opportunities: Analysis of growth opportunities in different product types, processes, end use industries, and regions for the molded interconnect device (MID) market.
Strategic Analysis: This includes M&A, new product development, and competitive landscape of the molded interconnect device (MID) market.
Analysis of competitive intensity of the industry based on Porter’s Five Forces model.
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FAQ
Q1. What is the molded interconnect device (MID) market size?
Answer: The global molded interconnect device (MID) market is expected to reach an estimated $3 billion by 2030.
Q2. What is the growth forecast for molded interconnect device (MID) market?
Answer: The global molded interconnect device (MID) market is expected to grow with a CAGR of 10.8% from 2024 to 2030.
Q3. What are the major drivers influencing the growth of the molded interconnect device (MID) market?
Answer: The major drivers for this market are growing demand for lightweight and durable electronic devices and increasing demand for miniaturized electronic devices.
Q4. What are the major segments for molded interconnect device (MID) market?
Answer: The future of the molded interconnect device (MID) market looks promising with opportunities in the telecommunication, consumer electronic, automotive, medical, industrial, and military & aerospace markets.
Q5. Who are the key molded interconnect device (MID) market companies?
Answer: Some of the key molded interconnect device (MID) companies are as follows:
• Molex
• TE Connectivity
• Amphenol
• LPKF Laser & Electronics
• Taoglas
Q6. Which molded interconnect device (MID) market segment will be the largest in future?
Answer: Lucintel forecasts that sensor is expected to witness the highest growth over the forecast period due to its variety of application like adaptive scrase control systems and in climate control applications.
Q7. In molded interconnect device (MID) market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness highest growth over the forecast period due to availability of skilled labor and presence of major original equipment manufacturers in the region.
Q.8 Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% customization without any additional cost.
This report answers following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for the molded interconnect device (MID) market by product type (antennae & connectivity modules, sensors, connectors & switches, lighting systems, and others), process (laser direct structuring, two-shot molding, and film techniques), end use industry (telecommunications, consumer electronics, automotive, medical, industrial, military & aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?
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