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The future of the hermetic packaging market looks promising with opportunities in the military & defense, aeronautics & space, automotive, energy & nuclear safety, medical, telecommunication, consumer electronics, and other industries. The global hermetic packaging market is expected to grow with a CAGR of 3% to 5% from 2021 to 2026. The major drivers for this market are growing adoption of hermetic packaging for protecting highly sensitive electronic components and increasing demand for hermetically packaged products in aerospace, automotive, and electronics.

A more than 150 page report is developed to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of hermetic packaging market report download the report brochure.
 
 
 
  
 

The study includes trends and forecast for the global hermetic packaging market by configiration, type, application, end use industry, and region as follows:

By Configuration [$M shipment analysis for 2015 – 2026]:
  • Multilayer Ceramic Packages
  • Pressed Ceramic Packages
  • Metal Can Packages

By Type [$M shipment analysis for 2015 – 2026]:
  • Passivation Glass
  • Reed Glass
  • Transponder Glass
  • Glass-Metal Sealing (GTMS)
  • Ceramic-Metal Sealing (CERTM)

By Application [$M shipment analysis for 2015 – 2026]:
  • Transistors
  • Sensors
  • Lasers
  • Airbag Ignitors
  • Photo Diodes
  • Oscillating Crystals
  • MEMS Switch
  • Others

By End Use Industry [$M shipment analysis for 2015 – 2026]:
  • Military & Defense
  • Aeronautics & Space
  • Automotive
  • Energy & Nuclear Safety
  • Medical
  • Telecommunication
  • Consumer Electronics
  • Others
 
Multilayer ceramic packages will remain the largest configuration segment due to increasing demand in high-frequency applications, such as data communication, wireless communication, and optical communication. 

Military & defense will remain the largest end use industry during the forecast period due to increasing requirement for customized solutions in air surveillance and underwater surveillance industries.

Asia Pacific will remain the largest region during the forecast period due to increasing energy needs in emerging economies and increasing defense spending in developing economies, such as, China, India, and South Korea. 

Some of the hermetic packaging companies profiled in this report include SCHOTT, AMETEK, Amkor Technology, Texas Instrument, and Kyocera Corporation.




 
Features of Hermetic Packaging Market
 
  • Market Size Estimates: Hermetic Packaging market size estimation in terms of value ($M)
  • Trend and Forecast Analysis: Market trends (2015-2020) and forecast (2021-2026) by various segments and regions.
  • Segmentation Analysis: Market size by configuration, type, application, and end use industry
  • Regional Analysis: Hermetic Packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different end use industries, type, configuration, application, and regions for hermetic packaging market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the hermetic packaging market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.




 
This report answers following 11 key questions
 
Q.1 What are some of the most promising potential, high-growth opportunities for the global hermetic packaging market by type (passivation glass, reed glass, transponder glass, glass-metal sealing (GTMS), and ceramic-metal sealing (CERTM)), configuration (multilayer ceramic packages, pressed ceramic packages, and metal can packages), application (transistors, sensors, lasers, airbag ignitors, photo diodes, oscillating crystals, mems switch, and others) end use industry (military & defense, aeronautics & space, automotive, energy & nuclear safety, medical, telecommunication, consumer electronics, and other), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the hermetic packaging market?
Q.5 What are the business risks and threats to the hermetic packaging market?
Q.6 What are emerging trends in this hermetic packaging market and the reasons behind them?
Q.7 What are some changing demands of customers in the hermetic packaging market?
Q.8 What are the new developments in the hermetic packaging market? Which companies are leading these developments?
Q.9 Who are the major players in the hermetic packaging market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the hermetic packaging market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M&A activities did take place in the last five years in the hermetic packaging market?
 

Table of Contents

 
  1. Executive Summary
  2. Market Background and Classifications
    • Introduction, Background, and Classifications
    • Supply Chain
    • Industry Drivers and Challenges
  3. Market Trends and Forecast Analysis from 2015 to 2026
    • Macroeconomic Trends (2015-2020) and Forecast (2021-2026)
    • Global Hermetic Packaging Market Trends (2015-2020) and Forecast (2021-2026)
    • Global Hermetic Packaging Market by End Use Industry
      • Military & Defense
      • Aeronautics & Space
      • Automotive
      • Energy & Nuclear Safety
      • Medical
      • Telecommunication
      • Consumer Electronics
      • Others
    • Global Hermetic Packaging Market by Configuration
      • Multilayer Ceramic Pacgages
      • Pressed Ceramic Packages
      • Metal Can Packages
    • Global Hermetic Packaging Market by Type
      • Passivation Glass
      • Reed Glass
      • Transponder Glass
      • Glass-Metal Sealing (GTMS)
      • Ceramic-Metal Sealing (CERTM)
    • Global Hermetic Packaging Market by Application
      • Transistors
      • Sensors
      • Lasers
      • Airbag Ignitors
      • Photo Diodes
      • Oscillating Crystals
      • MEMS Switch
      • Others
  4. Market Trends and Forecast Analysis by Region from 2015 to 2026
    • Global Hermetic Packaging Market by Region
    • North American Hermetic Packaging Market
      • Market by End Use Industry
      • Market by Configuration
      • The US Hermetic Packaging Market
      • The Canadian Hermetic Packaging Market
      • The Mexican Hermetic Packaging Market
    • European Hermetic Packaging Market
      • Market by End Use Industry
      • Market by Configuration
      • German Hermetic Packaging Market
      • United Kingdom Hermetic Packaging Market
      • French Hermetic Packaging Market
      • Italian Hermetic Packaging Market
    • APAC Hermetic Packaging Market
      • Market by End Use Industry
      • Market by Configuration
      • Chinese Hermetic Packaging Market
      • Japanese Hermetic Packaging Market
      • Indian Hermetic Packaging Market
      • South Korean Hermetic Packaging Market
    • ROW Hermetic Packaging Market
      • Market by End Use Industry
      • Market by Configuration
  5. Competitor Analysis
    • Product Portfolio Analysis
    • Geographical Reach
    • Porter’s Five Forces Analysis
  6. Growth Opportunities and Strategic Analysis
    • Growth Opportunity Analysis
      • Growth Opportunities for the Global Hermetic Packaging Market by End Use Industry
      • Growth Opportunities for the Global Hermetic Packaging Market by Type
      • Growth Opportunities for the Global Hermetic Packaging Market by Configuration
      • Growth Opportunities for the Global Hermetic Packaging Market by Application
      • Growth Opportunities for the Global Hermetic Packaging Market by Region
    • Emerging Trends in the Global Hermetic Packaging Market
    • Strategic Analysis
      • New Product Development
      • Capacity Expansion of the Global Hermetic Packaging Market
      • Technology Development
      • Mergers and Acquisitions in the Global Hermetic Packaging Industry
  7. Company Profiles of Leading Players
    • AMETEK Inc.
    • SCHOTT AG
    • Texas Instruments Incorporated
    • Teledyne Microelectronics
    • Amkor Technology
    • Micross Components Inc.
    • Materion Corporation
    • Legacy Technologies Inc.
    • Willow Technologies
    • KYOCERA Corporation.

.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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