Report Feature
The epoxy molding compound (EMC) semiconductor packaging market has witnessed growth over the last five years. It is expected to continue its growth momentum and reach approximately US $1,702 million by 2017. Numerous factors influence the EMC market in the semiconductor packaging industry.
A total of 57 figures /
charts and 19 tables are provided in this 91-page report to help in your business decisions. Sample figures with some insights are shown below. To learn the scope of, benefits, companies researched and other details of the emc semiconductor packaging market report, download the report brochure.Lucintel’s research indicates that the industry has displayed cyclical behavior: During the upturn years, the generated profits are used to sustain operations during economic downturns. During upturn periods, however, investment is greater than demand, due to which growth is slow for a longer period during the downturn and the poor performers struggle. The companies holding greater market share are creating higher profits because they have closer relationships with key customers and possess better research and development processes that yield better innovations and a greater ability to maintain profit during downturns.
The composition for epoxy molding compound for encapsulation of semiconductors are epoxy resins, fused silica, coupling agent, hardener, flame retardants, curing promoters, release agent, and low stress additives. Previously, bisphenol-A was used as the epoxy resin; epoxy cresol novolac is now preferred over bisphenol-A because of better resistance to heat. Epoxy resin is preferred to produce EMC due to its unique attributes. In EMCs, the filler represents up to 75% by weight. Fillers provide mechanical strength to the EMC and reduce the thermal expansion coefficient, which reduces the shrinkage after molding.
This unique report from Lucintel will provide you with valuable information, insights, and tools needed to identify new growth opportunities and operate your business successfully in this market. EMC semiconductor packaging market report will save hundreds of hours of your own personal research time and will significantly benefit you in expanding your business in this market. In today’s stringent economy, you need every advantage that you can find.
To make business, investment, and strategic decisions, you need timely, useful information. EMC semiconductor packaging market report fulfills this core need and is an indispensable reference guide for multinational materials suppliers, product manufacturers, investors, executives, distributors, and many more that operate in this market.
Some of the features of this report:
- Porter’s Five Forces analysis for global measuring system in opportunities of emc semiconductor packaging market
- Opportunities in the global emc semiconductor packaging market size in terms of value and volume
- Regional analysis of the opportunities in the emc semiconductor packaging market by the key regions of North America, Europe, Asia Pacific, and Rest of the World in terms of value and volume
- Opportunities in the global emc semiconductor packaging market trend (2007-2012) & forecast (2012-2017) in terms of value and volume by type and region
- Drivers and challenges for emc semiconductor packaging industry
- Growth opportunities and emerging trends of emc semiconductor packaging industry
- More than 57 figures/charts and 19 tables are provided in this roughly 91-page report
Table of Contents
List of Figures
List of Tables
Methodology
- In-depth interviews of the major players in this market
- Detailed secondary research from competitors’ financial statements and published data
- Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
- A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
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