Samsung’s 12-Layer 3D-TSV Chip Packaging Technology Receives the 2021 Technology Innovation Award by Lucintel

Dallas, October 21, 2021 -- Based on recent research on the semiconductor packaging market, Lucintel is pleased to announce Samsung’s 12-Layer 3D-TSV Chip Packaging Technology as the recipient of the “2021 Technology Innovation Award in the Semiconductor Packaging Market.” Lucintel chose Samsung for this award because of its breakthrough technology, which allows its customers to develop next generation high performance product with higher performance capacity without making any changes in their existing system’s configuration designs.

Samsung’s 12-Layer 3D-TSV Chip Packaging Technology is one of the most challenging packaging technologies, which is used for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair. It ensures that the thickness of the package (720?) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, thus resulting in substantial advancement in component design.

Samsung’s 12-Layer 3D-TSV Chip Packaging Technology is the 3D packaging technology features shorter data transmission time between chips than the currently existing wire bonding technology that results in significantly faster speed and lower power consumption. It focuses on securing all of the intricacies of ultra-performance memory, which can be used in new-age applications such as artificial intelligence (AI) and high-power computing (HPC).

Lucintel’s awards in innovation and industry excellence recognize outstanding achievements and latest endeavors by companies in various industries, identifying the most successful, innovative, and forward-thinking companies and products in business today. Lucintel awards are based on systematic and detailed research on the relevant markets to identify and recognize the most successful recent innovations. These initiatives enable companies to demonstrate high levels of industry impact and benefits to end users. To know more contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com

About Lucintel

Lucintel, a premier market research and Management Consulting firm based in Dallas, Texas, has served over 1,000 clients for over 20 years. With our in-depth analysis and sage advice, Lucintel offers solutions for your growth through game changing ideas and analysis of robust markets and unmet needs. Lucintel has been quoted in esteemed publications, including The Wall Street Journal, ZACKS, and The Financial Times. For further information, visit www.lucintel.com.

About Samsung

Samsung is based in South Korea and is a leading manufacturer of consumer as well as industrial electronic equipment and products such as semiconductors, personal computers, peripherals, monitors, televisions, and home appliances. Samsung’s 12-Layer 3D-TSV Chip Packaging Technology aims at delivering highest DRAM performance for applications that are data-intensive and high speed as shown in www.news.samsung.com/global/samsung-electronics-develops-industrys-first-12-layer-3d-tsv-chip-packaging-technology. Company focuses on developing superior products and services that contribute to a better global society. For further information, www.samsung.com/

Contact:

Brandon Fitzgerald

Lucintel

Dallas, Texas, USA

Email: brandon.fitzgerald@lucintel.com

Tel. 972.636.5056

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