Table of Contents
1. Executive Summary
2. Global 3D IC Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Global 3D IC Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Global 3D IC Market by Product
3.3.1: Stacked 3D
3.3.2: Monolithic 3D
3.4: Global 3D IC Market by Component
3.4.1: Through-Silicon via (TSV)
3.4.2: Through Glass via (TGV)
3.4.3: Silicon Interposer
3.5: Global 3D IC Market by Application
3.5.1: Logic
3.5.2: Imaging & optoelectronics
3.5.3: Memory
3.5.4: MEMS/Sensors
3.5.5: LED
3.6: Global 3D IC Market by End Use Industry
3.6.1: Consumer Electronics
3.6.2: Telecommunication
3.6.3: Automotive
3.6.4: Military & Aerospace
3.6.5: Medical Devices
3.6.6: Industrial
4. Market Trends and Forecast Analysis by Region from 2017 to 2028
4.1: Global 3D IC Market by Region
4.2: North American 3D IC Market
4.2.1: North American 3D IC Market by Product: Stacked 3D and Monolithic 3D
4.2.2: North American 3D IC Market by End Use Industry: Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, and Industrial
4.3: European 3D IC Market
4.3.1: European 3D IC Market by Product: Stacked 3D and Monolithic 3D
4.3.2: European 3D IC Market by End Use Industry: Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, and Industrial
4.4: APAC 3D IC Market
4.4.1: APAC 3D IC Market by Product: Stacked 3D and Monolithic 3D
4.4.2: APAC 3D IC Market by End Use Industry: Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, and Industrial
4.5: ROW 3D IC Market
4.5.1: ROW 3D IC Market by Product: Stacked 3D and Monolithic 3D
4.5.2: ROW 3D IC Market by End Use Industry: Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, and Industrial
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global 3D IC Market by Product
6.1.2: Growth Opportunities for the Global 3D IC Market by Component
6.1.3: Growth Opportunities for the Global 3D IC Market by Application
6.1.4: Growth Opportunities for the Global 3D IC Market by End Use Industry
6.1.5: Growth Opportunities for the Global 3D IC Market by Region
6.2: Emerging Trends in the Global 3D IC Market
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global 3D IC Market
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 3D IC Market
6.3.4: Certification and Licensing
7. Company Profiles of Leading Players
7.1: Tezzaron Semiconductor
7.2: 3M Company Besang
7.3: IBM Corporation
7.4: Xilin
7.5: Monolithic 3D
7.6: Intel Corporation
7.7: Toshiba Corp
7.8: Amkor Technology
7.9: Samsung Electronic