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3D IC and 2.5D IC Packaging Market Trends and Forecast

The future of the global 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries. The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028 with a CAGR of 11% from 2023 to 2028. The major drivers for this market are growing demand for miniaturized IoT based devices, emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
3D IC and 2.5D IC Packaging Market by Packaging Technology, Application, and End Use Industry
A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown here. 
3D IC and 2.5D IC Packaging Market by Segments

3D IC and 2.5D IC Packaging Market by Segment

The study includes trends and forecast for the global 3D IC and 2.5D IC packaging market by packaging technology, application, end use industry, and region, as follows:

3D IC and 2.5D IC Packaging Market by Packaging Technology [Shipment Analysis by Value from 2017 to 2028]:

  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 3D Through-Silicon Via (TSV)
  • 2.5D

3D IC and 2.5D IC Packaging Market by Application [Shipment Analysis by Value from 2017 to 2028]:

  • Logic
  • Imaging & Optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others

3D IC and 2.5D IC Packaging Market by End Use Industry [Shipment Analysis by Value from 2017 to 2028]:

  • Consumer Electronics
  • Industrial
  • Telecommunications
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • Others

3D IC and 2.5D IC Packaging Market by Region [Shipment Analysis by Value from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of 3D IC and 2.5D IC Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies, 3D IC and 2.5D IC packaging companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 3D IC and 2.5D IC packaging companies profiled in this report include- 
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • Toshiba
  • Advanced Semiconductor Engineering
  • Amkor Technology

3D IC and 2.5D IC Packaging Market Insights

  • Lucintel forecasts that the MEMS/sensor segment is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
  • Consumer electronics is expected to remain the largest segment due to the increasing adoption of 3D IC and 2.5D IC packaging based innovative memories, such as double-data-rate (DDR) DRAM and flash memory in the electronic devices, like smartphones and tablets.
  • APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs from the telecommunication and automotive industries, and the presence of key manufacturers in the region.

Features of the 3D IC and 2.5D IC Packaging Market

  • Market Size Estimates: 3D IC and 2.5D IC packaging market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: 3D IC and 2.5D IC packaging market size by various segments, such as by packaging technology, application, end use industry, and region
  • Regional Analysis: 3D IC and 2.5D IC packaging market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different packaging technologies, applications, end use industries, and regions for the 3D IC and 2.5D IC packaging market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the 3D IC and 2.5D IC packaging market.
  • Analysis of competitive intensity of the industry based on Porter’s Five Forces model.

FAQ

Q1. What is the 3D IC and 2.5D IC packaging market size?
Answer: The global 3D IC and 2.5D IC packaging market is expected to reach an estimated $81.1 billion by 2028.
Q2. What is the growth forecast for 3D IC and 2.5D IC packaging market?
Answer: The global 3D IC and 2.5D IC packaging market is expected to grow with a CAGR of 11% from 2023 to 2028.
Q3. What are the major drivers influencing the growth of the 3D IC and 2.5D IC packaging market?
Answer: The major drivers for this market are growing demand for miniaturized IoT based devices, the emergence of 5G technologies, and the widespread use of high-end computation, servers, and data centers.
Q4. What are the major segments for 3D IC and 2.5D IC packaging market?
Answer: The future of the 3D IC and 2.5D IC packaging market looks promising with opportunities in the consumer electronic, industrial, telecommunication, automotive, military & aerospace, and medical device industries.
Q5. Who are the key 3D IC and 2.5D IC packaging companies?
Answer: Some of the key 3D IC and 2.5D IC packaging companies are as follows:
  • Taiwan Semiconductor Manufacturing
  • Samsung Electronics
  • Toshiba
  • Advanced Semiconductor Engineering
  • Amkor Technology
Q6.Which 3D IC and 2.5D IC packaging segment will be the largest in future?
Answer: Lucintel forecasts that MEMS/sensor is expected to witness the highest growth over the forecast period due to the widespread use of 2.5D and 3D IC packaging in advanced MEMS and miniaturized sensors, such as microphones, accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, and smart sensors.
Q7. In 3D IC and 2.5D IC packaging market, which region is expected to be the largest in next 5 years?
Answer: APAC is expected to witness the highest growth over the forecast period due to the huge adoption of electronic gadgets among increasing population, growing demand for ICs in the telecommunication and automotive industries, and presence of key manufacturers in the region.
Q8.Do we receive customization in this report?
Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

Q.1. What are some of the most promising, high-growth opportunities for the global 3D IC and 2.5D IC packaging market by packaging technology (3D wafer-level chip-scale packaging (WLCSP), 3D through-silicon via (TSV), and 2.5D), application (logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and others), end use industry (consumer electronics, industrial, telecommunications, automotive, military & aerospace, medical devices, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?
 
For any questions related to 3D IC and 2.5D IC packaging market or related to 3D IC and 2.5D IC packaging companies, 3D IC and 2.5D IC packaging market size, 3D IC and 2.5D IC packaging market share, 3D IC and 2.5D IC packaging market growth, 3D IC and 2.5D IC packaging market research, write Lucintel analyst at email: helpdesk@lucintel.com we will be glad to get back to you soon.
 
Table of Contents
 
1. Executive Summary
 
2. Global 3D IC and 2.5D IC Packaging Market: Market Dynamics
2.1: Introduction, Background, and Classifications
2.2: Supply Chain
2.3: Industry Drivers and Challenges
 
3. Market Trends and Forecast Analysis from 2017 to 2028
3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
3.2: Global 3D IC and 2.5D IC Packaging Market Trends (2017-2022) and Forecast (2023-2028)
3.3: Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
3.3.1: 3D Wafer-Level Chip-Scale Packaging (WLCSP)
3.3.2: 3D Through-Silicon Via (TSV)
3.3.3: 2.5D
3.4: Global 3D IC and 2.5D IC Packaging Market by Application
3.4.1: Logic
3.4.2: Imaging & Optoelectronics
3.4.3: Memory
3.4.4: MEMS/Sensors
3.4.5: LED
3.4.6: Others
3.5: Global 3D IC and 2.5D IC Packaging Market by End Use Industry  
3.5.1: Consumer Electronics
3.5.2: Industrial
3.5.3: Telecommunications
3.5.4: Automotive
3.5.5: Military & Aerospace
3.5.6: Medical Devices
3.5.7: Others
 
4. Market Trends and Forecast Analysis by Region from 2017 to 2028
4.1: Global 3D IC and 2.5D IC Packaging Market by Region
4.2: North American 3D IC and 2.5D IC Packaging Market
4.2.1: North American 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.2.2: North American 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.3: European 3D IC and 2.5D IC Packaging Market
4.3.1: European 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.3.2: European 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.4: APAC 3D IC and 2.5D IC Packaging Market 
4.4.1: APAC 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.4.2: APAC 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
4.5: ROW 3D IC and 2.5D IC Packaging Market 
4.5.1: ROW 3D IC and 2.5D IC Packaging Market by Application: Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others
4.5.2: ROW 3D IC and 2.5D IC Packaging Market by End Use Industry: Consumer Electronics, Industrial, Telecommunications, Automotive, Military & Aerospace, Medical Devices, and Others
 
5. Competitor Analysis
5.1: Product Portfolio Analysis
5.2: Operational Integration
5.3: Porter’s Five Forces Analysis
 
6. Growth Opportunities and Strategic Analysis
6.1: Growth Opportunity Analysis
6.1.1: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Packaging Technology
6.1.2: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Application
6.1.3: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by End Use Industry
6.1.4: Growth Opportunities for the Global 3D IC and 2.5D IC Packaging Market by Region
6.2: Emerging Trends in the Global 3D IC and 2.5D IC Packaging Market 
6.3: Strategic Analysis
6.3.1: New Product Development
6.3.2: Capacity Expansion of the Global 3D IC and 2.5D IC Packaging Market 
6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 3D IC and 2.5D IC Packaging Market 
6.3.4: Certification and Licensing
 
7. Company Profiles of Leading Players
7.1: Taiwan Semiconductor Manufacturing
7.2: Samsung Electronics
7.3: Toshiba
7.4: Advanced Semiconductor Engineering
7.5: Amkor Technology 
 
.

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Lucintel has been in the business of market research and management consulting since 2000 and has published over 1000 market intelligence reports in various markets / applications and served over 1,000 clients worldwide. This study is a culmination of four months of full-time effort performed by Lucintel's analyst team. The analysts used the following sources for the creation and completion of this valuable report:
  • In-depth interviews of the major players in this market
  • Detailed secondary research from competitors’ financial statements and published data 
  • Extensive searches of published works, market, and database information pertaining to industry news, company press releases, and customer intentions
  • A compilation of the experiences, judgments, and insights of Lucintel’s professionals, who have analyzed and tracked this market over the years.
Extensive research and interviews are conducted across the supply chain of this market to estimate market share, market size, trends, drivers, challenges, and forecasts. Below is a brief summary of the primary interviews that were conducted by job function for this report.
 
Thus, Lucintel compiles vast amounts of data from numerous sources, validates the integrity of that data, and performs a comprehensive analysis. Lucintel then organizes the data, its findings, and insights into a concise report designed to support the strategic decision-making process. The figure below is a graphical representation of Lucintel’s research process. 
 

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