According to a market report by Lucintel, the future of the wire bond packaging in OSAT market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial applications. The wire bond packaging in the global OSAT market is expected to reach an estimated $17.1 billion by 2028 with a CAGR of 6.5% from 2023 to 2028. The major drivers for this market are growing demand for semiconductors and microelectronics and increasing requirement for wire bonding as an affordable, flexible connection technology.
In this market, assembly & packaging and testing are the two types of wire bond packaging in OSAT used by various end use industries. Lucintel forecasts that assembly & packaging is expected to witness higher growth over the forecast period due to the introduction latest chip packaging technologies such as TSV packaging and MEMs packaging.
Within this market, industrial is expected to witness higher growth over the forecast period due to the growing use of wire bond among micro-electronics industry.
APAC is expected to witness highest growth over the forecast period due to the presence of key manufacturers and availability of affordable packaging technology in the region.
Amkor, Jiangsu Changjiang Electronics Technology (JCET), Siliconware Precision Industries, PTI (Powertech Technology Inc.), and ChipMOS are the major suppliers in the wire bond packaging in the global OSAT market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities for wire bond packaging in the global OSAT market by service type, application, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities for Wire Bond Packaging in the Global OSAT Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for wire bond packaging in the global OSAT market by service type, application, and region, as follows:
Wire Bond Packaging in OSAT Market by Service Type [Value ($B) Shipment Analysis from 2017 to 2028]:
Assembly & Packaging
Testing
Wire Bond Packaging in OSAT Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:
Automotive
Telecommunications
Computing & Networking
Consumer Electronics
Industrial
Wire Bond Packaging in OSAT Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:
North America
Europe
Asia Pacific
The Rest of the World
This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at
helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global
Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis,
Growth Consulting, M&A, and
Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit
www.lucintel.com.
This report answers the following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for wire bond packaging in the global OSAT market by service type (assembly & packaging and testing), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?