Technology & Telecommunications

According to a market report by Lucintel, the future of the system in package (SiP) technology market looks promising with opportunities in the consumer electronic, automotive, telecommunication, industrial system, and aerospace and defense markets. The global system in package (SiP) technology market is expected to reach an estimated $40.2 billion by 2028 with a CAGR of 10.2% from 2023 to 2028. The major drivers for this market are growing demand for compact electronic device, increasing number of IoT devices, and rising trend of 5G network connected devices.



In this market, 2D IC packaging, 2.5D IC packaging, and 3D IC packaging are the major segments of system in package (SiP) technology market by technology. Lucintel forecast that 3D IC packaging will remain the larger segment over the forecast period because it delivers improved performance compared to other technologies.



Within this market, consumer electronics is expected to remain the largest segment due to the growing demand compact electronic devices along with on going technological advancements in smartphones and wearable devices.



North America will remain the largest region due to the growing adoption of connected devices and increasing demand for robots so as to automate the various workflows for better efficiency in the region.

Jiangsu Changjiang Electronics Technology, Chipmos Technologies, Powertech Technologies, ASE Group, Amkor Technology, and Fujitsu are the major suppliers in the global system in package (SiP) technology market.  



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global system in package (SiP) technology market by technology, method, end use, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities in the Global System in Package (SiP) Technology Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global system in package (SiP) technology market by technology, method, end use, and region, as follows:

This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 

Q.1. What are some of the most promising, high-growth opportunities for the system in package (SiP) technology market by technology (2D IC packaging, 2.5D IC packaging, and 3D IC packaging), method (wire bond and flip chip), end use (consumer electronics, automotive, telecommunication, industrial system, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?