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According to a market report by Lucintel, the future of the global semiconductor wafer polishing and grinding equipment market looks promising with opportunities in the foundry, memory manufacturer, and IDMs industries. The global semiconductor wafer polishing and grinding equipment market is expected to reach an estimated $0.33 billion with a CAGR of 5.0% from 2023 to 2028. The major drivers for this market are rise in the consumption of consumer electronics, increasing demand for MEMS, IC manufacturing, optics, and compound semiconductors, and growing trend for miniaturization of components.



In this market, semiconductor wafer polishing equipment and semiconductor wafer grinding equipment is different segment of semiconductor wafer polishing and grinding equipment by type. Lucintel forecast that semiconductor wafer polishing equipment will remain the largest type segment over the forecast period due to rapid expansion in the electronics industry that leads to increasing demand for micro electromechanical systems (MEMS), microchips, and integrated circuits for developing consumer electronic goods, such as smartphones, laptops and desktops.



Within this market, foundries is projected to record the highest growth from 2023 to 2028 due to their extensive utilization for composing integrated circuits, supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that helps the manufacturers to develop smart devices.



North American region is expected to witness the highest growth during the forecast period due to increase in demand of power semiconductor ICs for automotive applications and growing investments in electric infrastructure in this region.

Applied Materials, Ebara Corporation, Disco Corporation, Lapmaster, Logitech, Entrepix, Revasum, and Axus Technology are the major suppliers in the global semiconductor wafer polishing and grinding equipment market.



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global semiconductor wafer polishing and grinding equipment market by type, end use industry, and region. Lucintel has compiled a comprehensive research report titled “Growth Opportunities in the Global Semiconductor Wafer Polishing and Grinding Equipment Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global semiconductor wafer polishing and grinding equipment market by type, end use industry, and region, as follows:


Semiconductor Wafer Polishing and Grinding Equipment Market by Type [Value ($B) Shipment Analysis from 2017 to 2028]:




  • Semiconductor Wafer Polishing Equipment


  • Semiconductor Wafer Grinding Equipment



Semiconductor Wafer Polishing and Grinding Equipment Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:




  • Foundries


  • Memory Manufacturers


  • IDMs


  • Others



Semiconductor Wafer Polishing and Grinding Equipment Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:




  • North America


  • Europe


  • Asia Pacific


  • The Rest of the World



This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 


About Lucintel



Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 


This report answers the following 11 key questions:



Q.1. What are some of the most promising, high-growth opportunities for the semiconductor wafer polishing and grinding equipment market by type (semiconductor wafer polishing equipment and semiconductor wafer grinding equipment), end use industry (foundries, memory manufacturers, IDMs, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity did occur in the last five years and how did they impact the industry?