According to a new market report by Lucintel, the future of the global semiconductor wafer market looks promising with opportunities in the consumer electronics, telecommunications, automotive, defense, and healthcare industries. The global semiconductor wafer market is expected to grow with a CAGR of 5% from 2020 to 2025. The major growth drivers for this market are increasing adaption of the consumer electronic and automotive industries.
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In this market, Bridgman and allied methods (Bridgman), Float-zone (FZ), and Czochralski (CZ) and allied methods (Czochralski) are the types of crystal growth methods.
Within this market, consumer electronics, telecommunications, automotive, defense, and healthcare are the major end use industries.
APAC will remain the largest region, and it is also expected to witness the highest growth over the forecast period, supported by rising demand for consumer electronics such as smartphones, among others.
3M, Global Wafers Co., Ltd., Mechatronik Systemtechnik GmbH, Nissan Chemical Corporation, Samsung, Shanghai Simgui Technology, Toshiba, and Wafer World Inc. are among the major manufacturers of the global semiconductor wafer market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global semiconductor wafer market by crystal growth method, wafer-bonding method, node size, end use industry, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the Global Semiconductor Wafer Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global semiconductor wafer market by crystal growth method, wafer-bonding method, node size, end use industry, and region as follows:
By Crystal Growth Method [$M shipment analysis for 2014 – 2025]:
Bridgman and Allied Methods (Bridgman)
Float-Zone (FZ)
Czochralski (CZ) and Allied Methods (Czochralski)
By Wafer-Bonding Method [$M shipment analysis for 2014 – 2025]:
Direct Bonding
Surface-Activated Bonding
Anodic Bonding
Plasma Bonding
By Node Size [$M shipment analysis for 2014 – 2025]:
10 nm and Lower
12 to 22 nm
28 nm and Above
By End Use Industry [$M shipment analysis for 2014 – 2025]:
Telecommunications
Healthcare
Energy
Defense
Consumer Electronics
Industrial
Automotive
Others
By Region [$M shipment analysis for 2014 – 2025]:
North America
United States
Canada
Mexico
Europe
Asia Pacific
China
Japan
India
South Korea
Rest of the World
This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.