Technology & Telecommunications

According to a market report by Lucintel, the future of the semiconductor bonding material market looks promising with opportunities in the RF device, CMOS image sensor, LED, 3D NAND, and  MEMS & sensor applications. The global semiconductor bonding material market is expected to reach an estimated $0.90 billion by 2028 with a CAGR of 8% from 2023 to 2028. The major drivers for this market are rising demand for micro-electromechanical systems, growing preference for electric vehicles, and escalating demand for stacked die technology in IoT (internet of things)-based devices.



In this market, die bonder, wafer bonder, and flip chip bonder are the major segments of semiconductor bonding material market by product type. Lucintel forecasts that wafer bonder will remain the largest segment over the forecast period due to increasing application in manufacturing ICs, microsystems, nanoelectronics, and other micromechanical systems. 



Within this market, LED is expected to remain the largest segment due to expanding usage of semiconductor bonding materials in various applications, such as street lighting, modular lighting, refrigerated case lighting, and parking garage lighting. 



APAC will remain the largest region due to growing production and adoption of electronic products and the presence some of the largest semiconductor companies in countries like China, India, and Vietnam.

ASM Pacific, BE Semiconductor, Panasonic, Fasford, Shinkawa, and EV Group are the major suppliers in the global semiconductor bonding material market.



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global semiconductor bonding material market by product type, process type, bonding technology, application, and region. Lucintel has compiled a comprehensive research report titled “Growth Opportunities in the Global Semiconductor Bonding Material Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global semiconductor bonding material market by product type, process type, bonding technology, application, and region, as follows:

This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 

Q.1. What are some of the most promising, high-growth opportunities for the semiconductor bonding material market by product type (die bonder, wafer bonder, and flip chip bonder), process type (die to die bonding, die to wafer bonding, and wafer to wafer bonding), bonding technology (die bonding technology and wafer bonding technology), application (RF devices, CMOS image sensors, LED, 3D NAND, and MEMS & sensors), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?