According to a market report by Lucintel, the future of the rigid-flex PCB market looks promising with opportunities in the healthcare & pharmaceutical, automotive, industrial electronic, aerospace & defense, consumer electronic, and maritime transport end use industries. The global rigid-flex PCB market is expected to reach an estimated $2.3 by 2028 with a CAGR of 6.9% from 2023 to 2028. The major drivers for this market are growing demand for industrial electronics in factory automation and building automation application and increasing usage of these PCBs in advanced applications, such as automobiles, testing and measuring equipment, and others.
In this market, 2 layer, 4 layer, 6 layer, 8 layer, and 10 layer are major segments of speciality catalyst market by board type. Lucintel forecasts that 4 layer will remain the largest board type segment over the forecast period due to its increasing usage in the consumer electronic, medical, and computer applications.
Within this market, consumer electronics is expected to remain the largest segment due to continuously increasing digital connectivity has necessitated the usage of portable and secure electronic devices. This has resulted in increasing the usage of PCBs in order to provide unbreakable, water resistant, and damage-free devices.
APAC will remain the largest region due to the growing demand for advanced healthcare devices and high-end consumer electronics in the region.
Nippon, NCAB, TTM, Ibiden, and AT&S are the major suppliers in the global rigid-flex PCB market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global rigid-flex PCB market by board type, component, patterning technique, end use industry, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities in the Global Rigid-Flex PCB Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global rigid-flex PCB market by board type, component, patterning technique, end use industry, and region, as follows:
Rigid-Flex PCB Market by Board Type [Value ($B) Shipment Analysis from 2017 to 2028]:
2 Layer
4 Layer
6 Layer
8 Layer
10 Layer and Above
Rigid-Flex PCB Market by Component [Value ($B) Shipment Analysis from 2017 to 2028]:
Capacitors,
Diodes,
Integrated Circuits (ICS)
Resistors
Rigid-Flex PCB Market by Patterning Technique [Value ($B) Shipment Analysis from 2017 to 2028]:
Silk Screen Printing
PCB Milling
Photoengraving
Rigid-Flex PCB Market by End Use Industry [Value ($B) Shipment Analysis from 2017 to 2028]:
Healthcare & Pharmaceutical
Automotive
Industrial Electronics
Aerospace & Defense
Consumer Electronics
Maritime Transport
Others
Rigid-Flex PCB Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:
North America
Europe
Asia Pacific
The Rest of the World
This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
This report answers the following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for the global rigid-flex PCB market by board type (2 layer, 4 layer, 6 layer, 8 layer, and 10 layer, and above), component (capacitors, diodes, integrated circuits (ICS), and resistors), patterning technique (silk screen printing, PCB milling, and photoengraving), end use industry (healthcare & pharmaceutical, automotive, industrial electronics, aerospace & defense, consumer electronics, maritime transport, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?