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According to a market report by Lucintel, the future of the radiation-hardened electronic market looks promising with opportunities in the space, aerospace & defense, nuclear power plant, and medical applications. The global radiation-hardened electronic market is expected to reach an estimated $2.0 billion by 2028 with a CAGR of 3.1% from 2023 to 2028. The major drivers for this market are increasing demand of communication satellites for reconnaissance and surveillance operations, rising number of space missions, and considerable use of these technologies for developing power management devices.



In this market, mixed signal IC, processor & controller, memory, and power management are the major segments of radiation-hardened electronic market by component. Lucintel forecasts that power management will remain the largest segment over the forecast period due to the growing need for these devices in outer spaces, which ensures extreme durability against high-energy charged particles and ionizing radiation.



Within this market, space is expected to remain the largest segment due to the rising number of ISR (intelligence, surveillance, and reconnaissance) projects and space missions and growing number of satellites equipped with radiation-hardened electronic are being launched in the space.



North America will remain the largest region due to the presence of key players, supportive government investment for advanced radiation-hardened electronic for space projects, and increasing number of users for satellite-based telemetry and communication systems in the region.

Microchip Technology, BAE Systems, Renesas Electronics, Infineon Technologies, STMicroelectronics, Xilinx, and Texas Instruments are the major suppliers in the global radiation-hardened electronic market.  



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global radiation-hardened electronic market by product type, component, manufacturing technique, application, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities in the Global Radiation-Hardened Electronic Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global radiation-hardened electronic market by product type, component, manufacturing technique, application, and region, as follows:


Radiation-Hardened Electronic Market by Product Type [Shipment Analysis by Value from 2017 to 2028]:




  • Mixed Signal ICs


  • Processors & Controllers


  • Memory


  • Power Management



Radiation-Hardened Electronic Market by Component [Shipment Analysis by Value from 2017 to 2028]:




  • Radiation-Hardening by Design (RHBD)


  • Radiation-Hardening by Process (RHBP)



Radiation-Hardened Electronic Market by Manufacturing Technique [Shipment Analysis by Value from 2017 to 2028]:




  • Commercial-off-the-Shelf (COTS)


  • Custom Made



Radiation-Hardened Electronic Market by Application [Shipment Analysis by Value from 2017 to 2028]:




  • Space


  • Aerospace & Defense


  • Nuclear Power Plant


  • Medical


  • Others



Radiation-Hardened Electronic Market by Region [Shipment Analysis by Value from 2017 to 2028]:




  • North America


  • Europe


  • Asia Pacific


  • The Rest of the World



This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 


About Lucintel



Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 


This report answers the following 11 key questions:



Q.1. What are some of the most promising, high-growth opportunities for the radiation hardened electronic market by product type (mixed signal ICs, processors & controllers, memory, and power management), component (radiation-hardening by design and radiation-hardening by process), manufacturing technique (commercial-off-the-shelf and custom made), application (space, aerospace & defense, nuclear power plant, medical, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?