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According to a market report by Lucintel, the future of the printed circuit heat exchanger market looks promising with opportunities in the chemical processing, oil & gas, power generation, and industrial applications. The global printed circuit heat exchanger market is expected to reach an estimated $1.09 billion by 2028 with a CAGR of 4.3% from 2023 to 2028. The major drivers for this market are growing need for heat exchangers with exceptional performance and efficiency, increasing off-shore oil production and refineries, and expanding use of this exchanger in the petrochemical, refining, and upstream hydrocarbon processing industries.



In this market, steel and stainless steel, aluminum, nickel and nickel based alloy, copper, and titanium & titanium alloy are the major material segments. Lucintel forecasts that steel and stainless steel will remain the largest material segment over the forecast period as it can operate efficiently in both extreme hot and cold temperatures without any damage.



Within this market, chemical processing is expected to witness the highest growth over the forecast period due to the rising use of these heat exchangers in chemical processes as it can operate in less space and ensures fast and efficient performance.



North America will remain the largest region due to the huge demand for printed circuit heat exchangers among various end use industries, such as petrochemicals, oil and gas, and chemicals.

HEXCES, Alfa Laval, DongHwa Entec, Tanktech, Precision Micro, and VPE Thermal are the major suppliers in the global printed circuit heat exchanger market.  



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global printed circuit heat exchanger market by material, technology, application, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities in the Global Printed Circuit Heat Exchanger Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global printed circuit heat exchanger market by material, technology, application, and region, as follows:


Printed Circuit Heat Exchanger Market by Material [Value ($B) Shipment Analysis from 2017 to 2028]:




  • Steel and Stainless Steel


  • Aluminum


  • Nickel and Nickel Based Alloys


  • Copper


  • Titanium and Titanium Alloys


  • Others



Printed Circuit Heat Exchanger Market by Technology [Value ($B) Shipment Analysis from 2017 to 2028]:




  • Chemical Etching


  • Diffusion Bonding



Printed Circuit Heat Exchanger Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:




  • Chemical Processing


  • Oil and Gas


  • Power Generation


  • Industrial


  • Others



Printed Circuit Heat Exchanger Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:




  • North America


  • Europe


  • Asia Pacific


  • The Rest of the World



This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 


About Lucintel



Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 


This report answers the following 11 key questions:



Q.1. What are some of the most promising, high-growth opportunities for the global printed circuit heat exchanger market by material (steel and stainless steel, aluminum, nickel and nickel based alloys, copper, titanium and titanium alloys, and others), technology (chemical etching and diffusion bonding), application (chemical processing, oil and gas, power generation, industrial, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?