Chemical

According to a new market report published by Lucintel, the future of the semiconductor adhesive paste and film market looks promising with opportunities in the automotive, consumer electronics, aerospace and defense, and bioscience industries. The semiconductor adhesive paste and film market is expected to reach an estimated $78.7 billion by 2027 with a CAGR of 5.1% from 2021 to 2027. The major drivers for this market are increasing demand for semiconductors due to growth in consumer electronics and increasing electronic content in vehicles.

In this market, epoxy based adhesives, silicone based adhesives, acrylic based adhesives, and polyurethane based adhesives are the major product type of semiconductor adhesive paste and film market. Epoxy based adhesives will remain the largest segment and it is expected to witness the highest growth over the forecast period due to its superior properties, such as excellent adhesion, versatility, good electrical properties, compatibility, resistance to weathering, and ease of application that can readily be tailored according to the demand of manufacturer

Asia Pacific is expected to remain the largest region over the forecast period due to the large manufacturing base for semiconductors.

H.B. Fuller, Henkel, Master Bond, Panacol-Elosol, and 3M are among the major suppliers of semiconductor adhesive paste and film.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global semiconductor adhesive paste and film market by product type, application, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the Global Semiconductor Adhesive Paste and Film Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy as it provides a comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global semiconductor adhesive paste and film market by product type, application, and region as follows:




























This 107-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/adhesive-in-semiconductor-market-2017.aspx or write us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

Q.1 What are some of the most promising potential, high growth opportunities for the global semiconductor adhesive paste and film market by product type (epoxy based adhesives, silicone based adhesives, acrylic based adhesives, polyurethane based adhesives, and others), application (automotive, consumer electronics, aerospace and defense, biosciences, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2 Which segments will grow at a faster pace and why?

Q.3 Which regions will grow at a faster pace and why?

Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?

Q.5 What are the business risks and threats to the market?

Q.6 What are the emerging trends in this market and the reasons behind them?

Q.7 What are the changing demands of customers in the market?

Q.8 What are the new developments in the market? Which companies are leading these developments?

Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?

Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?

Q.11 What M & A activities have taken place in the last 5 years in this market?