According to a new market report published by Lucintel, the future of the interposer market looks promising with opportunities in the CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, and ASIC/FPGA markets. The global interposer market is expected to reach an estimated $728.7 million by 2027 with a CAGR of 17.4% from 2021 to 2027. The major drivers for this market are growing demand for 2.5D and 3D IC packaging and the miniaturization of electronic devices.
In this market, 2D, 2.5D, and 3D interposers are used in various applications, CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, and ASIC/FPGA. Lucintel forecasts that 2.5D interposer will remain the largest segment due to better speed, power, heterogeneous integration, and simplified integration properties.
Within the interposer market, ASIC/FPGA will remain the largest application during the forecast period due to growing demand of artificial intelligence, autonomous car, and machine learning.
Asia Pacific will remain the largest region over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) driving the demand for semiconductor and advance IC packaging in this region, thereby demand for interposer will also grow.
Emerging trends, which have a direct impact on the dynamics of the interposer industry, include increasing reticle size of interposer and growing adoption of RDL interposer technology for heterogeneous integration. Murata, Amkor, AGC, Atomica, and TSMC are among the major interposer manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global interposer market by product type, application, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Interposer Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global interposer market by product type, application, and region as follows:
By Product Type [$M shipment analysis for 2016 – 2027]:
2D Interposer
2.5D Interposer
3D Interposer
By Application [$M shipment analysis for 2016 – 2027]:
CIS
CPU/GPU
MEMS 3D Capping Interposer
RF Devices
Logic SoC
ASIC/FPGA
Others
By Region [$M shipment analysis for 2016 – 2027]:
North America
Europe
Asia Pacific
The Rest of the World
This 121-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. We offer market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.
This report answers following 11 key questions:
Q.1 What are some of the most promising potential, high-growth opportunities for the global interposer market by product type (2D interposer, 2.5D interposer, and 3D interposer), application (CIS, CPU/GPU, MEMS 3D capping interposer, RF devices, logic SoC, ASIC/FPGA, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the interposer market?
Q.5 What are the business risks and threats to the interposer market?
Q.6 What are emerging trends in the interposer market and the reasons behind them?
Q.7 What are some changing demands of customers in the interposer market?
Q.8 What are the new developments in the interposer market? Which companies are leading these developments?
Q.9 Who are the major players in the interposer market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in the interposer market, and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11. What M&A activities did take place in the last five years in the interposer market?