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According to a new market report published by Lucintel, the future of the Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market looks promising with opportunities in graphics, high performance computing, networking, and data center applications. The global HMC and HBM market is expected to reach an estimated $6.2 billion by 2027 with a CAGR of 28% from 2021 to 2027. The major drivers for this market are growing need for high bandwidth, low power consumption, highly scalable memories in various applications, growth in artificial intelligence, and miniaturization of electronic devices.


Browse 62 market data tables and 60 figures spread through 130 pages and in-depth TOC on “Global HMC and HBM Market"


To download report brochure, please go to https://www.lucintel.com/hybrid-memory-cube-and-high-bandwidth-memory-market.aspx and click "report brochure" tab from the menu.

In this market, Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) are two memory types that are used in a wide range of applications. Lucintel forecasts that HBM will remain the largest segment during the forecast period due to increasing demand for Advanced Graphics Processing Unit (GPU) and Central Processing Unit (CPU) in the high performance computing market.

Within the HMC and HBM market, high performance computing will remain the largest application segment during the forecast period due to growing adoption of artificial intelligence in retail, manufacturing, transportation, financial institution, and healthcare sectors.

Asia Pacific will remain the largest region by value during the forecast period due to growth in the enterprise storage and consumer electronics sectors and increasing number of data centers and servers.

Emerging trends, which have a direct impact on the dynamics of the industry, include development of advanced technology with new packaging options and increasing demand for HBM for enhancing virtual reality and augmented reality experience. Micron Technology, Samsung Electronics, and SK Hynix are among the major HMC and HBM manufacturers.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global HMC and HBM market by device type, application, memory type, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global HMC and HBM Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global HMC and HBM market by device type, application, memory type, and region as follows:


By Memory Type [$M shipment analysis for 2016 – 2027]:


•HMC (Hybrid Memory Cube)


•HBM (High-bandwidth Memory)


By Application [$M shipment analysis for 2016 – 2027]:


•Graphics


•High Performance Computing


•Networking


•Data Centers and Others


By Device Type [$M shipment analysis for 2016 – 2027]:


•CPU


•GPU


•FPGA


•APU


•ASIC and Others


By Region [$M shipment analysis for 2016 – 2027]:


•North America


•Europe


•Asia Pacific


•The Rest of the World

This more than 130 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/hybrid-memory-cube-and-high-bandwidth-memory-market.aspx or write us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. We offer market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

Q.1 What are some of the most promising potential, high-growth opportunities for the global HMC and HBM market by memory type (hybrid memory cube and high bandwidth memory), application (graphics, high performance computing, networking, and data centers and others), device type (CPU, GPU, FPGA, APU, and ASIC & others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2 Which segments will grow at a faster pace and why?

Q.3 Which regions will grow at a faster pace and why?

Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the HMC and HBM market?

Q.5 What are the business risks and threats to the HMC and HBM market?

Q.6 What are the emerging trends in the HMC and HBM market and the reasons behind them?

Q.7 What are some changing demands of customers in the HMC and HBM market?

Q.8 What are the new developments in the HMC and HBM market? Which companies are leading these developments?

Q.9 Who are the major players in the HMC and HBM market? What strategic initiatives are being implemented by key players for business growth?

Q.10 What are some of the competitive products and processes in the HMC and HBM market, and how big of a threat do they pose for loss of market share via material or product substitution?

Q.11 What M&A activities did take place in the last five years in the HMC and HBM market?