Chemical

According to a new market report published by Lucintel, the future of the high temperature adhesives market looks promising with opportunities in the electrical and electronics, automotive, and aerospace industries. The global high temperature adhesives market is expected to reach an estimated $4.6 billion by 2027 with a CAGR of 4.2% from 2021 to 2027.  The major drivers for this market are growth in electrical and electronics industry and increasing automotive production.

In this market, epoxy, silicone, acrylic, and other high temperature adhesives are used for electrical and electronics, automotive, aerospace, marine, and construction applications. Lucintel predicts that the demand for epoxy based high temperature adhesive is expected to remain the largest segment due to its ability to withstand higher temperatures of up to 200 degree Celsius. On the basis of its comprehensive research,

Within the high temperature adhesives market, the electrical and electronics segment is expected to remain the largest segment by value and volume consumption. Growing demand for PCBs from telecommunication, computer/peripherals, consumer, and microelectronic assembly applications, miniaturization of IC chips, and a rapid move towards smaller and higher-performance electronic devices is expected to spur growth for this segment over the forecast period.

Asia Pacific is expected to remain the largest market due to an increase in the production of printed circuit board in China, Taiwan, Japan, and South Korea and the use of high temperature adhesives in the assembly and packaging of electronic circuits. North America and Rest of the World are expected to witness significant growth over the forecast period due to new technological developments will be explored by high temperature adhesive manufacturers to meet consumers’ demand.

Emerging trends, which have a direct impact on the dynamics of the industry, include new silicone-based electrically conductive adhesives in automotive sensor applications, development of fast cure and high temperature resistant adhesives, and replacement of lead solder with electrically conductive adhesives. Henkel AG & Co KGaA, 3M Company, Avery Dennison Corporation, Master Bond Inc., and Permabond are among the major suppliers of high temperature adhesives.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global high temperature adhesives market by application, polymer type, technology, product form, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the Global High Temperature Adhesives Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy as it provides a comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global high temperature adhesives market by application, polymer type, technology, product form, and region as follows:






































This 205-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/high-temperature-adhesives-market.aspx or write us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

Q.1 What are some of the most promising potential, high growth opportunities for the global high temperature adhesives market by application (electrical and electronics, automotive, aerospace, and others), polymer type (epoxy, silicone, acrylic, and others), technology (reactive, solvent based, hot melt, and film), product form (paste, liquid, and film), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2 Which segments will grow at a faster pace and why?

Q.3 Which regions will grow at a faster pace and why?

Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?

Q.5 What are the business risks and threats to the market?

Q.6 What are the emerging trends in this market and the reasons behind them?

Q.7 What are the changing demands of customers in the market?

Q.8 What are the new developments in the market? Which companies are leading these developments?

Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?

Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?

Q.11 What M & A activities have taken place in the last 5 years in this market?