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According to a new market report published by Lucintel, the future of the global flexible printed circuit board (FPC) market looks promising with opportunities in the computer/peripheral, telecommunication, consumer electronics, medical, automotive, and aerospace & defense end use industries. The global FPC market is expected to reach an estimated $24.3 billion by 2027 with a CAGR of 3.1% from 2021 to 2027. The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.


Browse 134 market data tables and 122 figures spread through 197 pages and in-depth TOC on “Global Flexible Printed Circuit Board (FPC) Market"


To download report brochure, please go to https://www.lucintel.com/flexible-printed-circuit-board-market.aspx and click "report brochure" tab from the menu.

In this market, single layer, double layer, multi-layer, and rigid-flex PCBs are used in a wide range of electronic components. Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.

Within the flexible PCB market, telecommunication will remain the largest end use industry, supported by increasing demand for smartphones, data storage, 5G technology, and network solution sectors. The medical market is expected to witness the highest growth during the forecast period because it will witness increasing demand for portable, wireless, and more complex electronic assemblies.  

Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to increasing ADAS and vehicle safety features in automotive and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region.

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs. NOK Corporation, Zhen Ding Technology, Sumitomo, Flexium Interconnect, Fujikura, Nitto Denko, Compeq Manufacturing, Samsung Electro-Mechanics, Unimicron, and Young Poong Electronics are among the major manufacturers of FPCs.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global FPC market by end use industry, technology, laminate material type, raw material usage, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the Global FPC Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global FPC market by end use industry, technology, laminate material type, raw material usage, and region as follows:


By End Use Industry [$M and M Sqm shipment analysis for 2016 – 2027]:


•Computers/Peripherals


•Telecommunications


•Consumer Electronics


•Medical


•Automotive


•Aerospace and Defense 


•Others


By Technology [$M and M Sqm shipment analysis for 2016 – 2027]:


•Single Layer


•Double Layer


•Multi- Layer


•Rigid-Flex


By Laminate Materials Type [$M and M Sqm shipment analysis for 2016 – 2027]:


•Polyimide 


•Polyester and Others


By Raw Material Usage [$M and kilotons shipment analysis for 2016 – 2027]:


•Polyimide Film


•Polyester and Other Films


By Region [$M and M Sqm shipment analysis for 2016 – 2027]:


•North America


–United States


–Canada


–Mexico


•Europe


–Germany


–France


–UK


•Asia Pacific


–China


–Japan


–South Korea


–India


–Taiwan


•Rest of the World

This 197 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/flexible-printed-circuit-board-market.aspx or write us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

Q.1 What are some of the most promising potential, high-growth opportunities for the global FPC market by end use industry (computers/peripherals, telecommunication, consumer electronics, medical, automotive, aerospace and defense, and others), technology (single layer, double layer, multi-layer and rigid flex), laminate material type (polyimide and polyester & others), laminate raw material usage (polyimide films and polyester & other films), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2 Which segments will grow at a faster pace and why?

Q.3 Which regions will grow at a faster pace and why?

Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?

Q.5 What are the business risks and threats to the market?

Q.6 What are the emerging trends in this market and the reasons behind them?

Q.7 What are some changing demands of customers in the market?

Q.8 What are the new developments in the market? Which companies are leading these developments?

Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?

Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?

Q.11 What M & A activities did take place in the last five years in this market?