Chemical

The technologies in bonding films have undergone significant changes in recent years, from traditional bonding techniques to biomimetic bonding. The rising wave of new technologies, such as pressure cured bonding films are creating significant potential for bonding film in transportation, electrical and electronics, and packaging applications, due to its improved product durability, reliability, fast curing time, increased product performance, and design flexibility.

In the bonding film market, various technologies, such as thermally cured and pressure cured technologies are used in the transportation, electrical and electronics, and packaging applications. Growing demand in the electrical and electronics industry and increased demand in the aerospace sector with rise in composites applications, improvement in adhesive technologies, and better properties than conventional adhesives are creating new opportunities for various bonding film technologies.

Lucintel, a leading global strategic consulting and market research firm, has analyzed the technologies used in the global bonding film market and has now published a comprehensive research report entitled " Technology Trends in the Global Bonding Film Market 2022-2027: Trends, Forecast, and Opportunity Analysis ". This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the bonding film market.

Lucintel study finds that the total bonding film market size is projected to reach $1.6 billion by 2027 with a CAGR of 6% over the forecast period. Thermally cured technology is the largest segment of the bonding film market and is growing at an above-average rate. There is widespread application of this technology across the end use industry for better adhesion properties and suitable for high temperature area‘s application manufacturing.

Emerging trends, which have a direct impact on the dynamics of the industry, include the development of bonding film technology for dissimilar materials and bio-sourced bonding films for packaging application. Arkema, Solvay, Dai Nippon Printing, DuPont, Fastel Adhesives and Substrate Products, Formplast, Gurit, and H.B. Fuller are among the major manufacturers of bonding films.

This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the technology trends in the global bonding film material market by application, technology type, and region as follows:

Technology Readiness by Technology Type

Competitive Intensity and Regulatory Compliance

Disruption Potential by Technology Type

Trend and Forecast by Material Technology [Volume (M lbs) and $M shipment analysis for 2016 – 2027]:

• 
  Thermally Cured Bonding Film


• 
  Pressure Cured Bonding Film


• 
  Others
  
  
  
  • 
    Chemically Cured Bonding Film
  
  
  • 
    Light Cured Bonding Film
  
  
  
  

Latest Developments and Innovations in the Lithium-ion Battery Technologies

Companies / Ecosystems

Strategic Opportunities by Technology Type

This 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link https://www.lucintel.com/bonding-film-market.aspx or write us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.

This report answers following 11 key questions:

Q1. What are some of the most promising potential, high-growth opportunities for the technology trends in the global bonding film market by application (transportation, electrical & electronics, packaging, and others), material technology (thermally cured bonding film, pressure cured bonding film, and other) and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which technology segments will grow at a faster pace and why?

Q.3. Which regions will grow at a faster pace and why?

Q.4. What are the key factors affecting dynamics of different material technologies? What are the drivers and challenges of these material technologies in the global bonding film market?

Q.5. What are the business risks and threats to the technology trends in the global bonding film market?

Q.6. What are the emerging trends in the global bonding film market and the reasons behind them?

Q.7. Which technologies have potential of disruption in this market?

Q.8. What are the new developments in the technology trends in the global bonding film market? Which companies are leading these developments?

Q.9. Who are the major technology players in the global bonding film market? What strategic initiatives are being implemented by key players for business growth?

Q.10. What are the strategic growth opportunities in this bonding film technology space?

Q.11. What M&A activities did take place in the last five years in the global bonding film market in terms of technology trends?