According to a new market report published by Lucintel, the future of the advanced IC packaging market looks promising with opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The global advanced IC packaging market is expected to reach an estimated $52.3 billion by 2027 with a CAGR of 5.7% from 2021 to 2027. The major drivers for this market are growing semiconductor industry, increasing miniaturization of electronic devices, demand for higher speed and smaller pitch size, and increasing penetration of 2.5D/3D packaging technology.
In this market, flip-chip, fan-in WLP, embedded die, fan-out, and 2.5D/3D are the advanced packaging types used for manufacturing of IC in various end-use industries. Lucintel forecasts that flip-chip will remain the largest segment due to rise in demand for high speed portable devices and high packaging density.
Within the advanced IC packaging market, consumer and communication will remain the largest end-use industry during the forecast period. Increasing demand for smartphones, connected and high performance consumer devices with AI technology, and demand for high performance computing are driving the demand for advanced IC packaging in the consumer and communication market.
Asia Pacific will remain the largest region over the forecast period due to the presence of large foundries and manufacturing hub for electronic devices. Economic growth, growing urbanization, growing disposable income, and increasing adoption of digital technologies, such as 5G, Internet of things (IoT), and artificial intelligence (AI) are driving the demand for advanced IC packaging market in this region.
Emerging trends, which have a direct impact on the dynamics of the advanced IC packaging industry, include development of packaging solutions for AI and IoT and introduction of new IC packaging technologies, such as fan out and 2.5D/3D. Amkor, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel, and Samsung are among the major advanced IC packaging manufacturers.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global advanced IC packaging market by packaging type, end use industry, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the Global Advanced IC Packaging Market 2022-2027: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy as it provides a comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global advanced IC packaging market by packaging type, end use industry, and region as follows:
By Packaging Type [Value ($M) shipment analysis for 2016 – 2027]:
Flip-Chip
Fan-in Wafer Level (WLP) Packaging
Embedded-Die
Fan-Out
2.5D/3D
By End Use Industry [Value ($M) shipment analysis for 2016 – 2027]:
Consumer and Communication
Automotive
Industrial
Healthcare
Aerospace and Defense
Others
By Region [Value ($M) shipment analysis for 2016 – 2027]:
North America
Europe
Asia Pacific
The Rest of the World
This 205-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link www.lucintel.com/advanced-packaging-market.aspx helpdesk@lucintel.com.
About Lucintel
Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.
This report answers following 11 key questions:
Q.1 What are some of the most promising potential, high growth opportunities for the global advanced IC packaging market by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q. 2 Which segments will grow at a faster pace and why?
Q.3 Which regions will grow at a faster pace and why?
Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
Q.5 What are the business risks and threats to the market?
Q.6 What are the emerging trends in this market and the reasons behind them?
Q.7 What are the changing demands of customers in the market?
Q.8 What are the new developments in the market? Which companies are leading these developments?
Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
Q.11 What M & A activities have taken place in the last 5 years in this market?