Technology & Telecommunications

According to a market report by Lucintel, the future of the flip chip technology market looks promising with opportunities in the electronic, industrial, automotive & transport, healthcare, IT & telecommunication, and aerospace & defense industries. The global flip chip technology market is expected to reach an estimated $44.1 billion by 2028 with a CAGR of 5.8% from 2023 to 2028. The major drivers for this market are growing demand for electric vehicles, increasing trend of miniaturization, and rising penetration of these technology in consumer electronics, automotive, and telecommunication industries.



In this market, copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder, and gold bumping are the major segments of flip chip technology market by bumping technology. Lucintel forecasts that copper pillar is expected to witness highest growth over the forecast period due to increasing usage of copper pillar as an interconnector in transceiver, embedded processor, power management, baseband, ASIC, and SOC applications.



Within this market, electronics is expected to witness highest growth over the forecast period due to the increasing demand for flip chips in devices for chip encapsulating, chips electrical link, package interconnection to circuit boards, and package design.



APAC is expected to witness highest growth over the forecast period due to the continuous research and development by major players and existence of manufacturing hubs in India and China.

IBM, Intel, Fujitsu, 3M, and Samsung Electronics are the major suppliers in the global flip chip technology market.  



Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global flip chip technology market by packaging technology, bumping technology, end use industry, and region. Lucintel has compiled a comprehensive research report titled “Growth Opportunities in the Global Flip Chip Technology Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global flip chip technology market by packaging technology, bumping technology, end use industry, and region, as follows:

This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 

Q.1. What are some of the most promising, high-growth opportunities for the flip chip technology market by packaging technology (3D IC, 5D IC, and 2D IC), bumping technology (copper pillar, solder bumping, tin-lead eutectic solder, lead-free solder, gold bumping, and others), end use industry (electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?