According to a market report by Lucintel, the future of the flip chip packaging OSAT market looks promising with opportunities in the automotive, telecommunication, computing & networking, consumer electronic, and industrial applications. The global flip chip packaging OSAT market is expected to reach an estimated $2.9 billion by 2028 with a CAGR of 8.7% from 2023 to 2028. The major drivers for this market are growing demand for crypto-mining related packaging and expanding use of flip chips owing to its shorter assembly cycle time and improved signal density while decreasing the die size.
In this market, assembly & packaging and testing are the two service types of flip chip packaging OSAT used by various end use industries. Lucintel forecasts that assembly & packaging is expected to witness the highest growth over the forecast period because flip chip is well known for its unique form of packaging and increasing use of flip chip for dense connectivity along with superior electrical and thermal performance.
Within this market, industrial is expected to witness the highest growth over the forecast period due to the increasing usage in diversified application spaces owing to its improved reliability reduced manufacturing cost and enhanced performance.
North America is expected to witness the highest growth over the forecast period due to rising usage of flip chip for end point detection in forensics, governments, and banking & finance for safety concerns to improve business as well as customer experience.
Intel, Chipbond Technology, Taiwan Semiconductor, Siliconware Percision, and Texas Instrument are the major suppliers in the global flip chip packaging OSAT market.
Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global flip chip packaging OSAT market by service type, application, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities in the Global Flip Chip Packaging OSAT Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global flip chip packaging OSAT market by service type, application, and region, as follows:
Flip Chip Packaging OSAT Market by Service Type [Value ($B) Shipment Analysis from 2017 to 2028]:
Assembly & Packaging
Testing
Flip Chip Packaging OSAT Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:
Automotive
Telecommunications
Computing & Networking
Consumer Electronics
Industrial
Flip Chip Packaging OSAT Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:
North America
Europe
Asia Pacific
The Rest of the World
This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at
helpdesk@lucintel.com.
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This report answers the following 11 key questions:
Q.1. What are some of the most promising, high-growth opportunities for the global flip chip packaging OSAT market by service type (assembly & packaging and testing), application (automotive, telecommunications, computing & networking, consumer electronics, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
Q.2. Which segments will grow at a faster pace and why?
Q.3. Which region will grow at a faster pace and why?
Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
Q.5. What are the business risks and competitive threats in this market?
Q.6. What are the emerging trends in this market and the reasons behind them?
Q.7. What are some of the changing demands of customers in the market?
Q.8. What are the new developments in the market? Which companies are leading these developments?
Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?