Technology & Telecommunications

According to a new market report published by Lucintel, the future of the global flexible printed circuit board (FPC) market looks promising with opportunities in the computer/peripherals, telecommunications, consumer electronics, medical, automotive, and aerospace and defense industries. The  FPC market is expected to decline in 2020 due to global economic recession led by COVID-19. However, market will witness recovery in the year 2021 and it is expected to reach an estimated $23.4 billion by 2025 with a CAGR of 5% to 7% from 2020 to 2025. The major growth drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected device, and advancement in automotive electronics.

 

In this market, single layer, double layer, multi-layer, and rigid-flex PCBs are used in a wide range of electronic components. Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in automotive and telecommunication industries. The rigid-flex substrate is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications. 

 

Within the flexible PCB market, telecommunication will remain the largest end use industry and it is also expected to witness the highest growth during the forecast period due to increasing demand for smartphones, data storage, 5G technology, and network solution sectors.  

 

Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to the increasing ADAS and vehicle safety features in automotive, and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region. 

 

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs. NOK Corporation, Zhen Ding Technology, Sumitomo, Flexium Interconnect, Fujikura, Nitto Denko, Compeq Manufacturing, Samsung Electro-Mechanics, Unimicron, and Young Poong Electronics are among the major manufacturers of FPCs. 

 

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global FPC market by end use industries, by technology, by laminates material type, raw material usage, and region. Lucintel has prepared a comprehensive research report entitled “Growth Opportunities in the Global FPC Market 2019-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes a forecast for the global FPC market by end use industry, by technology, laminate material type, raw material usage, and region as follows:

 

By End Use Industry [$M and M Sqm shipment analysis for 2014 – 2025]: 

By Technology [$M and M Sqm shipment analysis for 2014 – 2025]:

By Laminate Materials Type [$M and M Sqm shipment analysis for 2014 – 2025]:   

By Raw Material Usage [$M and kilotons shipment analysis for 2014 – 2025]: 

By Region [$M and M Sqm shipment analysis for 2014 – 2025]:

This 200 page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents click on the link https://www.lucintel.com/flexible-printed-circuit-board-market.aspx, or contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com. 

 

About Lucintel

 

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.