Close Lucintel Chat
Didn't Find What You're Looking for?
Call us at +1972 636 5056 or write at helpdesk@Lucintel.com
Ask an Expert Provide Custom Requirements Download Sample Report Search Available Reports
  • helpdesk@Lucintel.com
  • |
  • Call Lucintel +1 972 636 5056
  • |
  • Login
  • |
  • Register
  • |
  • Search
  • |
'

According to a new market report published by Lucintel, the future of the advanced packaging market looks promising with opportunities in the consumer electronics, automotive, industrial, aerospace and defense, healthcare industries. The global advanced packaging market is expected to grow with a CAGR of 11% from 2020 to 2025. The major drivers for this market are growing demands for high-performance gadgets and growth of the lithography manufacturing processes.

To download report brochure, please go to https://www.lucintel.com/advanced-packaging-market.aspx and click "download brochure" tab from the menu



In this market, flip-chip ball grid array, flip chip CSP, wafer level CSP, 2.5D/3D and others are the major types used.

Within this market, consumer electronics is expected to witness the highest growth over the forecast period due to an increase in demand for smartphone and devices and Internet of Things (IoT).

Asia-Pacific will remain the largest region and it is also expected to witness the highest growth over the forecast period due to the growing semiconductor market.

Cardinal Matrix, Samsung Electronics Co., Ltd., Intel Corporation, Texas Instruments, Inc., and Qualcomm. are among the major suppliers in the global advanced packaging market.

Lucintel, a leading global strategic consulting and market research firm, has analyzed growth opportunities in the global advanced packaging market by product type, end use industry, and region. Lucintel has prepared a comprehensive research report titled “Growth Opportunities in the Global Advanced Packaging Market 2020-2025: Trends, Forecast, and Opportunity Analysis.” This Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global advanced packaging market by product type, end use industry, and region as follows:

By Product Type [Value ($ Million) shipment analysis for 2014 – 2025]:



  • Flip-Chip Ball Grid Array


  • Flip Chip CSP


  • Wafer Level CSP


  • 2.5D/3D


  • Others


By End Use Industry [Value ($ Million) shipment analysis for 2014 – 2025]:



  • Consumer Electronics


  • Automotive


  • Industrial


  • Aerospace & Defense


  • Healthcare


  • Others


By Region [Value ($ Million) shipment analysis for 2014 – 2025]:



  • North America




  • United States


  • Canada


  • Mexico




  • Europe




  • United Kingdom


  • Spain


  • Germany


  • France




  • Asia Pacific




  • China


  • India


  • Japan


  • South Korea




  • The Rest of the World




  • Brazil


 

A more than 150 pages research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or visit us at helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision makers in a variety of industries. For further information, visit www.lucintel.com.