Technology & Telecommunications

According to a market report by Lucintel, the future of the 3D IC market looks promising with opportunities in the consumer electronics, telecommunication, automotive, military & aerospace, medical device, and industrial markets. The global 3D IC market is expected to reach and estimated $18.1 billion by 2028 with a CAGR of 25.0% from 2023 to 2028. The major drivers for this market are increasing demand for advanced electronic products and growing application IOT by various end user verticals.



In this market, stacked 3D and monolithic 3D are the two major segments of 3D IC market by product. Lucintel forecasts that stacked 3D will be the larger segment over the forecast period because it is highly demanded in AI, machine learning, and data center applications. 



Within this market, consumer electronics is expected to witness the highest growth segment due to increasing demand for portable devices, such as tablets, smartphones, and laptops.



The Asia Pacific region is expected to witness the highest growth during the forecast period due to strong manufacturing capabilities and growing demand from various applications, such as automotive and consumer electronics.

United Microelectronics Corporation, Tezzaron Semiconductor Conductor Corporation, 3M Company Besang, IBM Corporation, Xilinx, Monolithic 3D, Intel Corporation, Toshiba Corp, Amkor Technology, and Samsung Electronics are the major suppliers in the global 3D IC market.  



Lucintel, a leading global strategic consulting and market research firm, has analysed growth opportunities in the global 3D IC market by product, component, application, end use industry, and region. Lucintel has compiled a comprehensive research report entitled “Growth Opportunities in the Global 3D IC Market 2023-2028: Trends, Forecast, and Opportunity Analysis.” The Lucintel report serves as a catalyst for growth strategy, as it provides comprehensive data and analysis on trends, key drivers, and directions. The study includes trends and forecast for the global 3D IC market by product, component, application, end use industry, and region, as follows:

This more than 150-page research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or email us at helpdesk@lucintel.com.

 

Lucintel, the premier global Management Consulting and market research firm, creates winning strategies for growth. Lucintel offers market assessments, competitive analysis, opportunity analysis, Growth Consulting, M&A, and Due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

 

Q.1. What are some of the most promising, high-growth opportunities for the 3D IC market by product (stacked 3D and monolithic 3D), component (through-silicon via (TSV), through glass via (TGV), and silicon interposer), application (logic, imaging & optoelectronics, memory, mems/sensors, and led), end use industry (consumer electronics, telecommunication, automotive, military & aerospace, medical devices, and industrial), and region (North America, Europe, Asia Pacific, and the Rest of the World)?

Q.2. Which segments will grow at a faster pace and why?

Q.3. Which region will grow at a faster pace and why?

Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?

Q.5. What are the business risks and competitive threats in this market?

Q.6. What are the emerging trends in this market and the reasons behind them?

Q.7. What are some of the changing demands of customers in the market?

Q.8. What are the new developments in the market? Which companies are leading these developments?

Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?

Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?

Q.11. What M&A activity has occurred in the last five years and what has its impact been on the industry?